TMVPOP中文资料安靠科技数据手册PDF规格书

Applications

PoP packages are designed for products requiring efficient memory architectures including multiple buses and increased memory density and performance, while reducing mounted area. Portable electronic products such as mobile phones (baseband or applications processor plus combo memory), digital cameras (image processor plus memory), portable media players (audio/graphics processor plus memory), gaming and other mobile applications can benefit from the combination of stacked package and small footprint offered by Amkor’s PoP family.

特性 Features

10-15 mm body sizes tooled per product table, additional sizes based on demand

Top package I/O interface 0.65 mm pitch accommodating 104 to 160 pin counts

Wafer thinning/handling <100 μm

Mature PoP platform with consistent product performance and reliability

Package configurations compliant with JEDEC standards

Bottom PSvfBGA and top FBGA/Stacked CSP packages are well established in high volume production with multi-region and factory support

Stacked package heights of 1.3 mm to 1.5 mm available in a variety of configurations (See Stack Up Tables on following pages)