丝印：TMS5704357BGWTSEP；Package：NFBGA；TMS570LC4357-SEP Hercules™ Microcontroller Based on the Arm® Cortex®-R Core in Space Enhanced Plastics

1 Features • VID - V62/18621 • Radiation Hardened – Single Event Latch-up (SEL) Immune to 43MeV-cm2/mg at 125°C – Total Ionizing Dose (TID) RLAT for Every Wafer Lot up to 30krad (Si) • Space Enhanced Plastic – Controlled Baseline – Gold Au wire – One Assembly/Test Site – One Fabrication

文件：6.96235 Mbytes 页数：229 Pages

TI

德州仪器

丝印：TMS5704357BGWTSEP；Package：NFBGA；TMS570LC4357-SEP Hercules™ Microcontroller Based on the Arm® Cortex®-R Core in Space Enhanced Plastics

1 Features • VID - V62/18621 • Radiation Hardened – Single Event Latch-up (SEL) Immune to 43MeV-cm2/mg at 125°C – Total Ionizing Dose (TID) RLAT for Every Wafer Lot up to 30krad (Si) • Space Enhanced Plastic – Controlled Baseline – Gold Au wire – One Assembly/Test Site – One Fabrication

文件：6.96235 Mbytes 页数：229 Pages

TI

德州仪器

丝印：TMS5704357BGWTSEP；Package：NFBGA；TMS570LC4357-SEP Hercules™ Microcontroller Based on the Arm® Cortex®-R Core in Space Enhanced Plastics

1 Features • VID - V62/18621 • Radiation Hardened – Single Event Latch-up (SEL) Immune to 43MeV-cm2/mg at 125°C – Total Ionizing Dose (TID) RLAT for Every Wafer Lot up to 30krad (Si) • Space Enhanced Plastic – Controlled Baseline – Gold Au wire – One Assembly/Test Site – One Fabrication

文件：6.96235 Mbytes 页数：229 Pages

TI

德州仪器

丝印：TMS5704357BGWTSEP；Package：NFBGA；TMS570LC4357-SEP Hercules™ Microcontroller Based on the Arm® Cortex®-R Core in Space Enhanced Plastics

1 Features • VID - V62/18621 • Radiation Hardened – Single Event Latch-up (SEL) Immune to 43MeV-cm2/mg at 125°C – Total Ionizing Dose (TID) RLAT for Every Wafer Lot up to 30krad (Si) • Space Enhanced Plastic – Controlled Baseline – Gold Au wire – One Assembly/Test Site – One Fabrication

文件：6.96235 Mbytes 页数：229 Pages

TI

德州仪器