TMS320C6701GJC150集成电路（IC）的DSP（数字信号处理器）规格书PDF中文资料

TMS320C6701GJC150属于集成电路（IC）的DSP（数字信号处理器）。由德州仪器制造生产的TMS320C6701GJC150DSP（数字信号处理器）数字信号处理器是类似于微处理器或微控制器的器件，但区别在于其内部架构经修改，适用于对连续数据流连续执行以乘法和加法运算为主的算法，而不是以条件逻辑或大量并发进程为主的算法。该器件通常用于诸如音频或视频信号处理等应用。

Highest Performance Floating-Point Digital

Signal Processor (DSP) TMS320C6701

− 8.3-, 6.7-, 6-ns Instruction Cycle Time

− 120-, 150-, 167-MHz Clock Rate

− Eight 32-Bit Instructions/Cycle

− 1 GFLOPS

− TMS320C6201 Fixed-Point DSP

Pin-Compatible

VelociTI Advanced Very Long Instruction

Word (VLIW) C67x CPU Core

− Eight Highly Independent Functional

Units:

− Four ALUs (Floating- and Fixed-Point)

− Two ALUs (Fixed-Point)

− Two Multipliers (Floating- and

Fixed-Point)

− Load-Store Architecture With 32 32-Bit

General-Purpose Registers

− Instruction Packing Reduces Code Size

− All Instructions Conditional

Instruction Set Features

− Hardware Support for IEEE

Single-Precision Instructions

− Hardware Support for IEEE

Double-Precision Instructions

− Byte-Addressable (8-, 16-, 32-Bit Data)

− 8-Bit Overflow Protection

− Saturation

− Bit-Field Extract, Set, Clear

− Bit-Counting

− Normalization

1M-Bit On-Chip SRAM

− 512K-Bit Internal Program/Cache

(16K 32-Bit Instructions)

− 512K-Bit Dual-Access Internal Data

(64K Bytes)

32-Bit External Memory Interface (EMIF)

− Glueless Interface to Synchronous

Memories: SDRAM and SBSRAM

− Glueless Interface to Asynchronous

Memories: SRAM and EPROM

− 52M-Byte Addressable External Memory

Space

Four-Channel Bootloading

Direct-Memory-Access (DMA) Controller

With an Auxiliary Channel

16-Bit Host-Port Interface (HPI)

− Access to Entire Memory Map

Two Multichannel Buffered Serial Ports

(McBSPs)

− Direct Interface to T1/E1, MVIP, SCSA

Framers

− ST-Bus-Switching Compatible

− Up to 256 Channels Each

− AC97-Compatible

− Serial-Peripheral-Interface (SPI)

Compatible (Motorola)

Two 32-Bit General-Purpose Timers

Flexible Phase-Locked-Loop (PLL) Clock

Generator

IEEE-1149.1 (JTAG†)

Boundary-Scan-Compatible

352-Pin Ball Grid Array (BGA) Package

(GJC Suffix)

0.18-μm/5-Level Metal Process

− CMOS Technology

3.3-V I/Os, 1.8-V Internal (120-, 150-MHz)

3.3-V I/Os, 1.9-V Internal (167-MHz Only)