TMP275AID传感器变送器的温度传感器-模拟数字输出规格书PDF中文资料

TMP275AID属于传感器变送器的温度传感器-模拟数字输出。由德州仪器制造生产的TMP275AID温度传感器 - 模拟和数字输出模拟和数字输出温度传感器可用于测量环境热能量。特征包括传感器类型、本地感测温度、远程感测温度、输出类型、电源电压和分辨率。传感器类型为模拟本地/远程/红外、模拟数字、本地/远程、数字本地/远程/红外或内部，感应温度范围为 -55°C 至 200°C。

1 Features

1• High Accuracy:

– ±0.5°C (Maximum) From −20°C to 100°C

– ±1°C (Maximum) From −40°C to 125°C

• Low Quiescent Current:

– 50 μA (Typical)

– 0.1-μA Standby

• Resolution: 9 to 12 Bits, User-Selectable

• Digital Output: SMBus™, Two-Wire, and I2C

Interface Compatibility

• 8 I2C/SMBus Addresses

• Wide Supply Range: 2.7 V to 5.5 V

• Small VSSOP-8 and SOIC-8 Packages

• No Specified Power-up Sequence Required; Two-

Wire Bus Pullups May Be Enabled Before V+

2 Applications

• Power-Supply Temperature Monitoring

• Computer Peripheral Thermal Protection

• Battery Management

• Office Machines

• Servers

• Thermostat Controls

• Environmental Monitoring and HVAC

• Electromechanical Device Temperature

• Data Logger

3 Description

The TMP275 is a ±0.5°C accurate integrated digital

temperature sensor with a 12-bit analog-to-digital

converter (ADC) that can operate as low as 2.7-V

supply voltage and is pin- and register-compatible

with the Texas Instruments LM75, TMP75, TMP75B,

and TMP175 devices. This device is available in

SOIC-8 and VSSOP-8 packages, and it requires no

external components to sense the temperature. The

TMP275 is capable of reading temperatures with a

maximum resolution of 0.0625°C (12 bits) and as low

as 0.5°C (9 bits), which allows the user to maximize

efficiency by programming for higher resolution or

faster conversion time. The device is specified over a

temperature range of –40°C to 125°C.

The TMP275 device features SMBus and two-wire

interface compatibility, and allows up to eight devices

on the same bus with the SMBus overtemperature

alert function. The factory-calibrated temperature

accuracy and the noise-immune digital interface

make the TMP275 the preferred solution for

temperature compensation of other sensors and

electronic components, without the need for

additional system-level calibration or elaborate board

layout for distributed temperature sensing.