TMP103HYFFR.B中文资料德州仪器数据手册PDF规格书

1 Features

1• Multiple Device Access (MDA):

– Global Read/Write Operations

• I2C™ and SMBus™-Compatible Interface

• Resolution: 8 Bits

• Accuracy: ±1°C Typical (–10°C to 100°C)

• Low Quiescent Current:

– 3-μA Active IQ at 0.25 Hz

– 1-μA Shutdown

• Supply Range: 1.4 V to 3.6 V

• Digital Output

• 4-Ball WCSP (DSBGA) Package

2 Applications

• Handsets

• Notebooks

• SSDs

• Servers

• Telecom

• Set Top Boxes

• Low Power Environmental

• Sensors

3 Description

The TMP103 is a digital output temperature sensor in

a four-ball wafer chip-scale package (WCSP). The

TMP103 is capable of reading temperatures to a

resolution of 1°C.

The TMP103 features a two-wire interface that is

compatible with both I2C and SMBus interfaces. In

addition, the interface supports multiple device

access (MDA) commands that allow the master to

communicate with multiple devices on the bus

simultaneously, eliminating the need to send

individual commands to each TMP103 on the bus.

Up to eight TMP103s can be tied together in parallel

and easily read by the host. The TMP103 is

especially suitable for space-constrained, powersensitive

applications with multiple temperature

measurement zones that must be monitored.

The TMP103 is specified for operation over a

temperature range of –40°C to 125°C.