首页 >TMP0320R>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SMDSchottkyBarrierDiode Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -AEC-Q101Qualified&PPAP. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
AMCCSeriesCutCoreFINEMET®F3CCSeriesCutCore | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨电子易亨电子股份有限公司 | ANACHIP | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨电子易亨电子股份有限公司 | ANACHIP | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨电子易亨电子股份有限公司 | ANACHIP | ||
Highreliabilitytomechanicalstress | ABRACON Abracon Corporation | ABRACON | ||
Single-EndedCordsets Basicfeatures Approval/ConformityCE cULus EAC WEEE | BalluffBalluff Korea Ltd. 巴鲁夫巴鲁夫集团 | Balluff | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gold | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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