丝印：TLV3501；Package：SOIC；TLV350x 4.5-ns, Rail-to-Rail, High-Speed Comparator in Microsize Packages

1 Features 1• High Speed: 4.5 ns • Rail-to-Rail I/O • Supply Voltage: 2.7 V to 5.5 V • Push-Pull CMOS Output Stage • Shutdown (TLV3501 Only) • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) • Low Supply Current: 3.2 mA 2 Applications • Automatic Test Equipment • Wireless B

文件：1.01506 Mbytes 页数：33 Pages

TI

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Crystal Unit SMD 1.6x1.2 37.4MHz

Features: Surface Mount Hermetic Package Excellent Reliability Performance Good Frequency Perturbation and Stability over temperature Ultra Miniature Package Moisture Sensitivity Level (MSL) : Level-1 Description and Applications: Surface mount 1.6mmx1.2mm crystal unit for use in wireless

文件：234.88 Kbytes 页数：8 Pages

TAI-SAW

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Cordless Telephone Signal Processor

Description Cordless telephone signal processor reduces the need for many external components. Features RF Receiver Part IF converter, FM demodulator, RSSI-digital information LF Part Microphone amplifier, earpiece amplifier, compander, preemphasis, deemphasis, scrambler, descrambler,

文件：317.21 Kbytes 页数：20 Pages

TEMIC

HIGH EFFICIENT, LOW COST FLASHLIGHT LED DRIVE

文件：145.08 Kbytes 页数：4 Pages

UTC

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