TLV2374-EP数据手册TI中文资料规格书

描述 Description

The TLV237x single supply operational amplifiers provide rail-to-rail input and output capability. The TLV237x takes the minimum operating supply voltage down to 2.7 V over the extended automotive temperature range while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz bandwidth from only 550 µA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8 V supplies down to ±1.35 V) a variety of rechargeable cells.The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an ideal alternative for the TLC227x in battery-powered applications. The rail-to-rail input stage further increases its versatility. The TLV237x is the seventh member of a rapidly growing number of RRIO products available from Texas Instruments and it is the first to allow operation up to 16-V rails with good ac performance. The 2.7-V operation makes the TLV237x compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power microcontrollers available today including Texas Instruments’ MSP430.

特性 Features

• Controlled Baseline
• One Assembly/Test Site, One Fabrication Site

• Extended Temperature Performance of -55°C to 125°C
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree
• Rail-To-Rail Input/Output
• Wide Bandwidth . . . 3 MHz
• High Slew Rate . . . 2.4 V/µs
• Supply Voltage Range . . . 2.7 V to 16 V
• Supply Current . . . 550 µA/Channel
• Input Noise Voltage . . . 39 nV/Hz\\
• Input Bias Current . . . 1 pA
• Specified Temperature Range
-55°C to 125°C
• Ultrasmall Packaging
• 5 Pin SOT-23 (TLV2371)
• 8 Pin MSOP (TLV2372)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.