TLV2231Y中文资料德州仪器数据手册PDF规格书

Output Swing Includes Both Supply Rails

Low Noise . . . 15 nV/√Hz Typ at f = 1 kHz

Low Input Bias Current . . . 1 pA Typ

Fully Specified for Single-Supply 3-V and

5-V Operation

Common-Mode Input Voltage Range

Includes Negative Rail

High Gain Bandwidth . . . 2 MHz at

VDD = 5 V With 600-Ω Load

High Slew Rate . . . 1.6 V/μs at VDD = 5 V

Wide Supply Voltage Range

2.7 V to 10 V

Macromodel Included

description

The TLV2231 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of

bandwidth and 1.6 V/μs of slew rate for applications requiring good ac performance. The device exhibits

rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2231

is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.

The TLV2231, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of

high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels

combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing

applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great

choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600-Ω loads for

telecom applications.

With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin

SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal

source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that

is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage

paths. The OUT and IN– terminals are on the same end of the board for providing negative feedback. Finally,

gain setting resistors and the decoupling capacitor are easily placed around the package.