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281-1AB

BOARDLEVELPOWERSEMICONDUCTORHEATSINKS

•Nointerfacematerialisneeded •Copperwithmattetinplatingforimprovedsolderabilityandassembly •BoththecomponentandtheheatsinkareinstalledonthePC-boardutilizing standardSMTassemblyequipmentfor”Tape&Reel”and“Tube”formats •EIAstandardsandESDprotectionares

ETCList of Unclassifed Manufacturers

未分类制造商

供应商型号品牌批号封装库存备注价格