Features

• High thermal conductivity

• Low thermal resistance

• High compressibility and compliancy

• Good electrical insulation

Applications

Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile

Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED,

Mother Board,Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device,

Wireless Hub, DDR ll Module, etc.

Best for high power applications

TG-A9000-5-5-1.0属于风扇，热管理 > 热 - 垫，片。T-Global Technology制造生产的TG-A9000-5-5-1.0热 - 垫，片这些器件可用于在元器件和与其相连的散热器之间提供热传递。它们由各种材料制成并具有各种厚度，这些材料和厚度可决定导热率和/或电阻率。器件的一面或两面带有粘合剂，有助于与所应用表面保持接触。