Ultra Soft Thermal Pad

Features • High thermal conductivity • High compressibility • Natural tack Applications: Best for high power applications

文件：515.78 Kbytes 页数：1 Pages

TGLOBAL

Fiberglass Mesh Series Thermal Pad

Features •High thermal conductivity •Fiberglass on one side •Non-deforming •Electrical insulation Application: Suitable for voltage-resistant products

文件：453.34 Kbytes 页数：1 Pages

TGLOBAL

High Performance Thermal Pad

Features • Great thermal conductivity • Difficult to be deformed • Easy to assemble • One side low tack Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply

文件：315.98 Kbytes 页数：1 Pages

TGLOBAL

High Performance Thermal Pad

Features • Great thermal conductivity • Difficult to be deformed • Easy to assemble • One side low tack Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply

文件：315.98 Kbytes 页数：1 Pages

TGLOBAL

High Performance Thermal Pad

Features • Great thermal conductivity • Difficult to be deformed • Easy to assemble • One side low tack Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply

文件：315.98 Kbytes 页数：1 Pages

TGLOBAL

High Performance Thermal Pad

Features • Great thermal conductivity • Difficult to be deformed • Easy to assemble • One side low tack Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply

文件：315.98 Kbytes 页数：1 Pages

TGLOBAL

High Performance Thermal Pad

Features • Great thermal conductivity • Difficult to be deformed • Easy to assemble • One side low tack Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply

文件：315.98 Kbytes 页数：1 Pages

TGLOBAL

High Performance Thermal Pad

Features • Great thermal conductivity • Difficult to be deformed • Easy to assemble • One side low tack Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply

文件：315.98 Kbytes 页数：1 Pages

TGLOBAL

High Performance Thermal Pad

Features • Great thermal conductivity • Difficult to be deformed • Easy to assemble • One side low tack Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply

文件：315.98 Kbytes 页数：1 Pages

TGLOBAL

High Performance Thermal Pad

Features • Great thermal conductivity • Difficult to be deformed • Easy to assemble • One side low tack Applications Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board,Power Supply

文件：315.98 Kbytes 页数：1 Pages

TGLOBAL