TFA9887UK数据手册恩XP中文资料规格书

描述 Description

Overview Housed in a small, cost-efficient wafer-level chip-scale package, this complete audio system includes an embedded DSP (running advanced algorithms for speaker boost and protection), a high-efficiency 2.65 W Class-D audio amplifier, and an intelligent DC-to-DC converter.

特性 Features

End-user benefitsLouder sound: the maximum possible from small speakers
Deeper bass: reproduces lower frequencies than traditional systems
Better quality: unmatched sound clarity with less clipping in the amplifier and less distortion from the speaker
Longer life: prevents speaker damage with adaptive excursion control and real-time temperature protection

Key featuresSophisticated algorithm for speaker boost protection maximizes audio performance
Environmental awareness lets the system adapt automatically to acoustic and thermal changes
Adaptive excursion control guarantees the speaker membrane stays within its rated limit for excursion
Direct, real-time measurement of the voice-coil temperature ensures the system keeps the coil within its rated limit
Advanced clip controller prevents clipping even with a sagging supply voltage
Optional bandwidth extension increases low-frequency response
Dedicated speech mode with speech activity detector
Intelligent 5.3 V DC-to-DC converter maximizes audio headroom from any supply level
Reference output available for Acoustic Echo Cancellation (AEC) in the host processor
High efficiency and low power dissipation
Maximum RMS output power:1.65 W into 8 Ω at 3.6 V power supply (THD = 1%)
2.65 W into 4 Ω at 3.6 V power supply (THD = 1%)

Wide supply voltage range (fully operational from 2.5 to 5.5 V)
I²S digital input and output audio interface
WLCSP29 package (3.19 x 2.07 x 0.6 mm)

应用 Application

Mobile phones
Tablet computers
Portable navigation devices (PNDs)
Portable gaming devices
Portable audio players