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ATA6616

Single-packageHighPerformance,LowPowerAVR8-bitMicrocontrollerwithLIN

Description Atmel®ATA6616/ATA6617isaSystem-in-Package(SiP)product,whichisparticularlysuitedforcompleteLIN-busnodeapplications.Itsupportshighlyintegratedsolutionsforin-vehicleLINnetworks.ThefirstchipistheLIN-system-basis-chip(LIN-SBC)ATA6624,whichhasanintegrated

AtmelAtmel Corporation

爱特梅尔爱特梅尔公司

ATA6616

8K/16KFlashMicrocontrollerwithLINTransceiver,5VRegulatorandWatchdog

AtmelAtmel Corporation

爱特梅尔爱特梅尔公司

ATA6616C

8K/16KFlashMicrocontrollerwithLINTransceiver,5VRegulatorandWatchdog

AtmelAtmel Corporation

爱特梅尔爱特梅尔公司

ATA6616-EK

AtmelATA6616-EK/ATA6617-EKDevelopmentBoardV1.1

AtmelAtmel Corporation

爱特梅尔爱特梅尔公司

AWU6616

HELP3EDual-band1&5,6CDMA/WCDMA3.4VLinearPowerAmplifierModule

ANADIGICS

ANADIGICS, Inc

BOXER-6616

FanlessEmbeddedBoxPCwithIntel®Celeron®ProcessorN3350/N4200

Features ■Intel®Pentium®N42002.5GHz/Celeron®N33502.4GHz ■DDR3L1600MHzSODIMMx1,MemoryMax.upto8GB ■COMx6:RS-232/422/485x2+RS-232x4 ■USB3.2Gen1x4 ■VGA+HDMIOutput,SupportDualView/SimultaneousDisplay ■Supports2.5”DriveBayx1,mSATA ■Supports8Ch

AAEONAAEON Technology

研扬科技研扬科技(苏州)有限公司

CPH6616

N-ChannelSiliconMOSFETGeneral-PurposeSwitchingDevice

SANYOSanyo Semicon Device

三洋三洋电机株式会社

IRF6616

DirectFETPowerMOSFET

Description TheIRF6616combinesthelatestHEXFET®PowerMOSFETSilicontechnologywiththeadvancedDirectFETTMpackagingtoachievelowcombinedon-stateandswitchinglossinapackagethathasthefootprintareaofanSO-8andonly0.7mmprofile.TheDirectFETpackageiscompatiblewithexis

IRF

International Rectifier

IRF6616PBF

RoHScompliantcontainingnoleadorbormide

Description TheIRF6616combinesthelatestHEXFET®PowerMOSFETSilicontechnologywiththeadvancedDirectFETTMpackagingtoachievelowcombinedon-stateandswitchinglossinapackagethathasthefootprintareaofanSO-8andonly0.7mmprofile.TheDirectFETpackageiscompatiblewithexis

IRF

International Rectifier

IRF6616PBF

RoHScompliantcontainingnoleadorbormide

Description TheIRF6616combinesthelatestHEXFET®PowerMOSFETSilicontechnologywiththeadvancedDirectFETTMpackagingtoachievelowcombinedon-stateandswitchinglossinapackagethathasthefootprintareaofanSO-8andonly0.7mmprofile.TheDirectFETpackageiscompatiblewithexis

IRF

International Rectifier

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