TDA4VPE-Q1中文资料德州仪器数据手册PDF规格书

1 Features

Processor cores:

• Up to Three C7x floating point, vector DSP, up to

1.0GHz, 240GFLOPS, 768GOPS

• Up to Two Deep-learning matrix multiply

accelerator (MMAv2), up to 16TOPS (8b) at

1.0GHz

• Up to Two Vision Processing Accelerators (VPAC)

with Image Signal Processor (ISP) and multiple

vision assist accelerators

• Depth and Motion Processing Accelerators

(DMPAC)

• Four Arm® Cortex®-A72 microprocessor

subsystem at up to 2.0GHz

– 2MB shared L2 cache per quad-core Cortex®-

A72 cluster

– 32KB L1 DCache and 48KB L1 ICache per

Cortex®-A72 core

• Eight Arm® Cortex®-R5F MCUs at up to 1.0GHz

– 16K I-Cache, 16K D-Cache, 64K L2 TCM

– Two Arm® Cortex®-R5F MCUs in isolated MCU

subsystem

– Six Arm® Cortex®-R5F MCUs in general

compute partition

• GPU IMG BXS-4-64, 256kB Cache, up to 800MHz,

50GFLOPS, 4GTexels/s (TDA4VPE)

• Custom-designed interconnect fabric supporting

near max processing entitlement

Memory subsystem:

• Up to 8MB of on-chip L3 RAM with ECC and

coherency

– ECC error protection

– Shared coherent cache

– Supports internal DMA engine

• Up to Two External Memory Interface (EMIF)

modules with ECC

– Supports LPDDR4 memory types

– Supports speeds up to 4266MT/s

– Up to 2x32-b bus with inline ECC up to 34GB/s

• General-Purpose Memory Controller (GPMC)

• 3x512KB on-chip SRAM in MAIN domain,

protected by ECC

Functional Safety:

• Functional Safety-Compliant targeted (on select

part numbers)

– Developed for functional safety applications

– Documentation available to aid ISO 26262

functional safety system design up to ASIL-D/

SIL-3 targeted

– Systematic capability up to ASIL-D/SIL-3

targeted

– Hardware integrity up to ASIL-D/SIL-3 targeted

for MCU Domain

– Hardware integrity up to ASIL-B/SIL-2 targeted

for Main Domain

– Hardware integrity up to ASIL-D/SIL-3 targeted

for Extended MCU (EMCU) portion of the Main

Domain

– Safety-related certification

• ISO 26262 planned

• AEC-Q100 qualified on part number variants

ending in Q1

Device security (on select part numbers):

• Secure boot with secure run-time support

• Customer programmable root key, up to RSA-4K

or ECC-512

• Embedded hardware security module

• Crypto hardware accelerators – PKA with ECC,

AES, SHA, RNG, DES and 3DES

High speed serial interfaces:

• Integrated Ethernet switch supporting 4 external

ports

– Two ports support 5Gb, 10Gb USXGMII/XFI

– All ports support 1Gb, 2.5Gb SGMII

– All ports can support QSGMII. A maximum of 1

QSGMII can be enabled and uses all 4 internal

lanes

• Up to 2x2L/1x4L PCI-Express® (PCIe) Gen3

controllers

– Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3

(8.0GT/s) operation with auto-negotiation

• One USB 3.0 dual-role device (DRD) subsystem

– Enhanced SuperSpeed Gen1 Port

– Supports Type-C switching

– Independently configurable as USB host, USB

peripheral, or USB DRD

• Three CSI2.0 4L Camera Serial interface RX (CSIRX)

plus two CSI2.0 4L TX (CSI-TX) with DPHY

– MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2

– CSI-RX supports for 1,2,3, or 4 data lane mode

up to 2.5Gbps per lane

– CSI-TX supports for 1,2, or 4 data lane mode

up to 2.5Gbps per lane

Ethernet:

• Two RGMII/RMII interfaces

Automotive interfaces:

• Twenty Modular Controller Area Network (MCAN)

modules with full CAN-FD support

Display subsystem:

• Two DSI 4L TX (up to 2.5k)

• One eDP/DP interface with Multi-Display Support

(MST)

• One DPI

Audio interfaces:

• Five Multichannel Audio Serial Port (MCASP)

modules

Video acceleration:

• H.264/H.265 Encode/Decode, up to 960MP/s

Flash memory interfaces:

• Embedded MultiMediaCard Interface ( eMMC™

5.1)

• One Secure Digital® 3.0 / Secure Digital Input

Output 3.0 interfaces (SD3.0/SDIO3.0

• Universal Flash Storage (UFS 2.1) interface with

two lanes

• Two independent flash interfaces configured as

– One OSPI or HyperBus™ or QSPI flash

interfaces, and

– One QSPI flash interface

System-on-Chip (SoC) architecture:

• 16-nm FinFET technology

• 27mm × 27mm, 0.8-mm pitch, 1063-pin FCBGA

(AND), enables IPC class 3 PCB routing

TPS6594-Q1 Companion Power Management

ICs (PMIC):

• Functional Safety support up to ASIL-D

• Flexible mapping to support different use cases

2 Applications

• Automotive:

• Advanced surround view and park assistance systems

• Autonomous sensor fusion / perception systems including camera, radar and LiDAR sensors

• Mono and multi-sensor Front camera systems

• Next generation eMirror systems

• Off-highway vehicle control

• ADAS Domain Controller

3 Description

The TDA4VPE-Q1 TDA4APE-Q1 processor family is based on the evolutionary Jacinto™ 7 architecture, targeted

at ADAS and Autonomous Vehicle (AV) applications and built on extensive market knowledge accumulated

over a decade of TI’s leadership in the ADAS processor market. The unique combination high-performance

compute, deep-learning engine, dedicated accelerators for signal and image processing in an functional safety

compliant targeted architecture make the TDA4VPE-Q1 TDA4APE-Q1 devices a great fit for several imaging,

vision, radar, sensor fusion and AI applications such as: Robotics, Mobile machineries, Off-highway vehicle

controller, Machine Vision, AI BOX, Gateways, Retail automation, Medical Imaging, and so on. The TDA4VPEQ1

TDA4APE-Q1 provides high performance compute for both traditional and deep learning algorithms at

industry leading power/performance ratios with a high level of system integration to enable scalability and lower

costs for advanced automotive platforms supporting multiple sensor modalities in centralized ECUs or standalone

sensors. Key cores include next generation DSP with scalar and vector cores, dedicated deep learning

and traditional algorithm accelerators, latest Arm and GPU processors for general compute, an integrated next

generation imaging subsystem (ISP), video codec, Ethernet hub and isolated MCU island. All protected by

automotive grade safety and security hardware accelerators.

Key Performance Cores Overview

The “C7x” next generation DSP combines TI’s industry leading DSP and EVE cores into a single higher

performance core and adds floating point vector calculation capabilities, enabling backward compatibility for

legacy code while simplifying software programming. A single instance of the new “MMAv2” deep learning

accelerator enables performance up to 8 TOPS within the lowest power envelope in the industry when

operating at the typical automotive worst case junction temperature of 125°C. The dedicated ADAS/AV hardware

accelerators provide vision pre-processing plus distance and motion processing with no impact on system

performance.

General Compute Cores and Integration Overview

Separate four core cluster configuration of Arm® Cortex®-A72 facilitates multi-OS applications with minimal

need for a software hypervisor. Four Arm® Cortex®-R5F subsystems enable low-level, timing critical processing

tasks to leave the Arm® Cortex®-A72’s unencumbered for applications. The integrated IMG BXS-4-64 GPU

offers up to 50GFLOPS to enable dynamic 3D rendering for enhanced viewing applications. Building on the

existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support

for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features

support operations up to ASIL-D/SIL-3 levels while the integrated security features protect data against modern

day attacks. To enable systems requiring heavy data bandwidth, a PCIe hub and Gigabit Ethernet switch are

included along with CSI-2 ports to support throughput for many sensor inputs. To further the integration, the

TDA4VPE-Q1 TDA4APE-Q1 family also includes an MCU island eliminating the need for an external system

microcontroller.