TDA4VM集成电路（IC）的片上系统（SoC）规格书PDF中文资料

1 Features

Processor cores:

• C7x floating point, vector DSP, up to 1.0GHz, 80

GFLOPS, 256 GOPS

• Deep-learning matrix multiply accelerator (MMA),

up to 8 TOPS (8b) at 1.0GHz

• Vision Processing Accelerators (VPAC) with Image

Signal Processor (ISP) and multiple vision assist

accelerators

• Depth and Motion Processing Accelerators

(DMPAC)

• Dual 64-bit Arm® Cortex®-A72 microprocessor

subsystem at up to 2.0GHz

– 1MB shared L2 cache per dual-core Cortex®-

A72 cluster

– 32KB L1 DCache and 48KB L1 ICache per

Cortex®-A72 core

• Six Arm® Cortex®-R5F MCUs at up to 1.0GHz

– 16K I-Cache, 16K D-Cache, 64K L2 TCM

– Two Arm® Cortex®-R5F MCUs in isolated MCU

subsystem

– Four Arm® Cortex®-R5F MCUs in general

compute partition

• Two C66x floating point DSP, up to 1.35GHz,

40GFLOPS, 160GOPS

• 3D GPU PowerVR® Rogue 8XE GE8430, up to

750MHz, 96GFLOPS, 6Gpix/sec

• Custom-designed interconnect fabric supporting

near max processing entitlement

Memory subsystem:

• Up to 8MB of on-chip L3 RAM with ECC and

coherency

– ECC error protection

– Shared coherent cache

– Supports internal DMA engine

• External Memory Interface (EMIF) module with

ECC

– Supports LPDDR4 memory types

– Supports speeds up to 4266MT/s

– 32-bit data bus with inline ECC

• General-Purpose Memory Controller (GPMC)

• 512KB on-chip SRAM in MAIN domain, protected

by ECC

Functional Safety:

• Functional Safety-Compliant targeted (on select

part numbers)

– Developed for functional safety applications

– Documentation will be available to aid ISO

26262/IEC 61508 functional safety system

design up to ASIL-D/SIL-3 targeted

– Systematic capability up to ASIL-D/SC-3

targeted

– Hardware integrity up to ASIL-D/SIL-3 targeted

for MCU Domain

– Hardware integrity up to ASIL-B/SIL-2 targeted

for Main Domain

– Safety-related certifications

• ISO 26262 certification up to ASIL-D by TÜV

SÜD planned

• IEC 61508 certification up to SIL-3 by TÜV

SÜD planned

• AEC-Q100 qualified on part number variants

ending in Q1

Device security (on select part numbers):

• Secure boot with secure run-time support

• Customer programmable root key, up to RSA-4K

or ECC-512

• Embedded hardware security module

• Crypto hardware accelerators – PKA with ECC,

AES, SHA, RNG, DES and 3DES

High speed serial interfaces:

• Integrated Ethernet switch supporting up to 8

external ports

– All ports support 2.5Gb SGMII

– All ports support 1Gb SGMII/RGMII

– All ports support 100Mb RMII

– Any two ports support QSGMII (using 4 internal

ports per QSGMII)

• Up to four PCI-Express® (PCIe) Gen3 controllers

– Up to two lanes per controller

– Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3

(8.0GT/s) operation with auto-negotiation

• Two USB 3.0 dual-role device (DRD) subsystem

– Two enhanced SuperSpeed Gen1 Ports

– Each port supports Type-C switching

– Each port independently configurable as USB

host, USB peripheral, or USB DRD

Automotive interfaces:

• Sixteen Modular Controller Area Network (MCAN)

modules with full CAN-FD support

• Two CSI2.0 4L RX plus One CSI2.0 4L TX

– 2.5Gbps RX throughput per lane (20Gbps total)

• DOinsep leaDyP s/uDbPs iynsteterfmac:e with Multi-Display Support

(MST)

– HDCP1.4/HDCP2.2 high-bandwidth digital

content protection

• One DSI TX (up to 2.5K)

• Up to two DPI

Audio interfaces:

• Twelve Multichannel Audio Serial Port (MCASP)

modules

Video acceleration:

• Ultra-HD video, one (3840 × 2160p, 60 fps), or two

(3840 × 2160p, 30 fps) H.264/H.265 decode

• Full-HD video, four (1920 × 1080p, 60 fps), or eight

(1920 × 1080p, 30 fps) H.264/H.265 decode

• Full-HD video, one (1920 × 1080p, 60 fps), or up to

three (1920 × 1080p, 30 fps) H.264 encode

Flash memory interfaces:

• Embedded MultiMediaCard Interface ( eMMC™

5.1)

• Universal Flash Storage (UFS 2.1) interface with

two lanes

• Two Secure Digital® 3.0/Secure Digital Input

Output 3.0 interfaces (SD3.0/SDIO3.0)

• Two simultaneous flash interfaces configured as

– One OSPI and one QSPI flash interfaces

– or one HyperBus™ and one QSPI flash

interface

System-on-Chip (SoC) architecture:

• 16-nm FinFET technology

• 24 mm × 24 mm, 0.8-mm pitch, 827-pin FCBGA

(ALF), enables IPC class 3 PCB routing

TPS6594-Q1 Companion Power Management

ICs (PMIC):

• Functional Safety support up to ASIL-D

• Flexible mapping to support different use cases

2 Applications

• Advanced surround view and park assistance systems

• Autonomous sensor fusion / perception systems including camera, radar and lidar sensors

• Mono and multi-sensor Front camera systems

• Next generation eMirror systems

• Industrial mobile robot (AGV/AMR) with safety functions

• Machine vision

• Smart retail

• Smart shopping cart

• Construction and agriculture

• Edge AI BOX

• Single Board Computer

• Off-highway vehicle control

• Industrial PC with AI

3 Description

The TDA4VM processor family targeted at ADAS and Autonomous Vehicle (AV) applications and built on

extensive market knowledge accumulated over a decade of TI’s leadership in the ADAS processor market.

The unique combination high-performance compute, deep-learning engine, dedicated accelerators for signal

and image processing in a functional safety compliant targeted architecture make the TDA4VM devices a

great fit for several industrial applications, such as: Robotics, Machine Vision, Radar, and so on. The TDA4VM

provides high performance compute for both traditional and deep learning algorithms at industry leading power/

performance ratios with a high level of system integration to enable scalability and lower costs for advanced

automotive platforms supporting multiple sensor modalities in centralized ECUs or stand-alone sensors. Key

cores include next generation DSP with scalar and vector cores, dedicated deep learning and traditional

algorithm accelerators, latest Arm and GPU processors for general compute, an integrated next generation

imaging subsystem (ISP), video codec, Ethernet hub and isolated MCU island. All protected by automotive grade

safety and security hardware accelerators.

Key Performance Cores Overview

The “C7x” next generation DSP combines TI’s industry leading DSP and EVE cores into a single higher

performance core and adds floating point vector calculation capabilities, enabling backward compatibility for

legacy code while simplifying software programming. The new “MMA” deep learning accelerator enables

performance up to 8 TOPS within the lowest power envelope in the industry when operating at the typical

automotive worst case junction temperature of 125°C. The dedicated ADAS/AV hardware accelerators provide

vision pre-processing plus distance and motion processing with no impact on system performance.

General Compute Cores and Integration Overview

Separate dual core cluster configuration of Arm® Cortex®-A72 facilitates multi-OS applications with minimal need

for a software hypervisor. Up to six Arm® Cortex®-R5F subsystems enable low-level, timing critical processing

tasks to leave the Arm® Cortex®-A72’s unencumbered for applications. The integrated “8XE GE8430” GPU

offers up to 100 GFLOPS to enable dynamic 3D rendering for enhanced viewing applications. Building on the

existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support

for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features

support operations up to ASIL-D/SIL-3 levels while the integrated security features protect data against modern

day attacks. To enable systems requiring heavy data bandwidth, a PCIe hub and Gigabit Ethernet switch are

included along with CSI-2 ports to support throughput for many sensor inputs. To further the integration, the

TDA4VM family also includes an MCU island eliminating the need for an external system microcontroller.