TDA4AL-Q1数据手册TI中文资料规格书

描述 Description

The TDA4VE TDA4AL TDA4VL processor family is based on the evolutionary Jacinto™ 7 architecture, targeted at Smart Vision Camera applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the Vision processor market. The TDA4AL provides high performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced vision camera applications. Key cores include next generation DSP with scalar and vector cores, dedicated deep learning and traditional algorithm accelerators, latest Arm and GPU processors for general compute, an integrated next generation imaging subsystem (ISP), video codec, and isolated MCU island. All protected by automotive grade safety and security hardware accelerators.

Key Performance Cores Overview: The “C7x” next generation DSP combines TI’s industry leading DSP and EVE cores into a single higher performance core and adds floating-point vector calculation capabilities, enabling backward compatibility for legacy code while simplifying software programming. The new “MMA” deep learning accelerator enables performance up to 8 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C. The dedicated Vision hardware accelerators provide vision pre-processing with no impact on system performance.

General Compute Cores and Integration Overview: Separate dual core cluster configuration of Arm® Cortex®-A72 facilitates multi-OS applications with minimal need for a software hypervisor. Up to four Arm® Cortex®-R5F subsystems enable low-level, timing critical processing tasks to leave the Arm® Cortex®-A72 core’s unencumbered for applications. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features support operations up to ASIL-D levels while the integrated security features protect data against modern day attacks. CSI2.0 ports enable multi sensor inputs. To further the integration, the TDA4VE TDA4AL TDA4VL family also includes an MCU island eliminating the need for an external system microcontroller.

特性 Features

Processor cores:
• Two C7x floating point, vector DSP, up to 1.0 GHz, 160 GFLOPS, 512 GOPS
• Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0 GHz
• Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
• Depth and Motion Processing Accelerators (DMPAC)
• Dual 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2 GHz
• 1MB shared L2 cache per dual-core Cortex-A72 cluster
• 32KB L1 DCache and 48KB L1 ICache per Cortex-A72 core

• Up to Six Arm Cortex-R5F MCUs at up to 1.0 GHz
• 16K I-Cache, 16K D-Cache, 64K L2 TCM
• Two Arm Cortex-R5F MCUs in isolated MCU subsystem
• Four (TDA4VE) or Two (TDA4AL/TDA4VL)Arm Cortex-R5F MCUs in general compute partition

• GPU IMG BXS-64-4, 256kB Cache, up to 800 MHz, 50 GFLOPS, 4 GTexels/s (TDA4VE and TDA4VL)
• Custom-designed interconnect fabric supporting near max processing entitlement
Memory subsystem:
• Up to 4MB of on-chip L3 RAM with ECC and coherency
• ECC error protection
• Shared coherent cache
• Supports internal DMA engine

• Up to Two External Memory Interface (EMIF) modules with ECC
• Supports LPDDR4 memory types
• Supports speeds up to 4266 MT/s
• Two (TDA4VE) or One (TDA4AL/TDA4VL) 32-bit data bus with inline ECC up to 17 GB/s per EMIF

• General-Purpose Memory Controller (GPMC)
• One (TDA4AL/TDA4VL) or Two (TDA4VE) 512KB on-chip SRAM in MAIN domain, protected by ECC
Functional Safety:
• Functional Safety-Compliant targeted (on select part numbers)
• Developed for functional safety applications
• Documentation available to aid ISO 26262 functional safety system design up to ASIL-D/SIL-3 targeted
• Systematic capability up to ASIL-D/SIL-3 targeted
• Hardware integrity up to ASIL-D/SIL-3 targeted for MCU Domain
• Hardware integrity up to ASIL-B/SIL-2 targeted for Main Domain
• Hardware integrity up to ASIL-D/SIL-3 targeted for Extended MCU (EMCU) portion of the Main Domain
• Safety-related certification
• ISO 26262 planned

Device security (on select part numbers):
• Secure boot with secure runtime support
• Customer programmable root key, up to RSA-4K or ECC-512
• Embedded hardware security module
• Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES
High speed serial interfaces:
• One PCI-Express (PCIe) Gen3 controllers
• Up to four lanes per controller
• Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation

• One USB 3.0 dual-role device (DRD) subsystem
• Enhanced SuperSpeed Gen1 Port
• Supports Type-C switching
• Independently configurable as USB host, USB peripheral, or USB DRD

• Two CSI2.0 4L RX plus Two CSI2.04L TX
Automotive interfaces:
• Twenty Modular Controller Area Network (MCAN) modules with full CAN-FD support
Display subsystem:
• One (TDA4AL/TDA4VL) or Two (TDA4VE) DSI 4L TX (up to 2.5K)
• One eDP 4L (TDA4VE/TDA4VL)
• One DPI
Audio interfaces:
• Five Multichannel Audio Serial Port (MCASP) modules
Video acceleration:
• TDA4VE: H.264/H.265 Encode/Decode (up to 480 MP/s)
• TDA4AL: H.264/H.265 Encode only (up to 480 MP/s)
• TDA4VL: H.264/H.265 Encode/Decode (up to 240 MP/s)
Ethernet:
• Two RMII/RGMII interfaces
Flash memory interfaces:
• Embedded MultiMediaCard Interface ( eMMC™ 5.1)
• One Secure Digital 3.0/Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0)
• Two simultaneous flash interfaces configured as
• One OSPI or HyperBus™ or QSPI, and
• One QSPI

System-on-Chip (SoC) architecture:
• 16-nm FinFET technology
• 23 mm x 23 mm, 0.8-mm pitch, 770-pin FCBGA (ALZ)
Companion Power Management ICs (PMIC):
• Functional Safety-Compliant support up to ASIL-D / SIL-3 targeted
• Flexible mapping to support different use cases