ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0

文件：6.77233 Mbytes 页数：426 Pages

TI

德州仪器

ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0

文件：6.77233 Mbytes 页数：426 Pages

TI

德州仪器

丝印：TDA；Package：FCBGA；TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0

文件：6.75614 Mbytes 页数：427 Pages

TI

德州仪器

TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0

文件：6.75614 Mbytes 页数：427 Pages

TI

德州仪器

ADAS Applications Processor 17mm Package (AAS Package) Silicon Revision 2.0

文件：4.95167 Mbytes 页数：377 Pages

TI

德州仪器

ADAS 应用处理器

TI’s new TDA2x System-on-Chip (SoC) is a highly optimized and scalable family ofdevices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). TheTDA2x family enables broad ADAS applications in automobiles by integrating an optimal mix ofperformance, low power and AD • Architecture Designed for ADAS Applications\n• Full-HD Video (1920 × 1080p, 60fps)\n• Dual ARM® Cortex®-A15 Microprocessor Subsystem \n• Up to Two C66x Floating-Point VLIW DSP • Fully Object-Code Compatible With C67x and C64x+\n• Up to Thirty-two 16 × 16-Bit Fixed-Point Multiplies per Cycle\n• Up;

TI

德州仪器

10W CAR RADIO AUDIO AMPLIFIER

The UTC  TDA2003 is a monolithic audio power amplifier integrated circuit. Very Low External Component Required. High Current Output ( up to 3 A). Low Harmonic and Crossover Distortion. Built-in Over Temperature Protection. Short Circuit Protection Between all Pins.;

UTC

友顺

音频功率放大器

TDSEMIC

拓电半导体

Package：14-SOIC（0.154"，3.90mm 宽）；包装：管件 类别：集成电路（IC） 全半桥驱动器 描述：IC DRIVER DUAL HS MOSFET PDSO-14

Infineon

英飞凌

Package：14-SOIC（0.154"，3.90mm 宽）；包装：管件 类别：集成电路（IC） 全半桥驱动器 描述：IC DRIVER DUAL HS MOSFET PDSO-14

Infineon

英飞凌