Class AB stereo headphone driver

GENERAL DESCRIPTION The TDA1308; TDA1308A is an integrated class AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. FEATURES • Wide tempe

文件：95.75 Kbytes 页数：16 Pages

PHI

飞利浦

Class-AB stereo headphone driver

General description The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump wafer level chip-size package (WLCSP8). The device is fabricated in a 1µm Complementary Metal Oxide Semicondu

文件：117.77 Kbytes 页数：19 Pages

恩XP

Class AB stereo headphone driver

GENERAL DESCRIPTION The TDA1308; TDA1308A is an integrated class AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. FEATURES • Wide tempe

文件：95.75 Kbytes 页数：16 Pages

PHI

飞利浦

Class-AB stereo headphone driver

General description The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump wafer level chip-size package (WLCSP8). The device is fabricated in a 1µm Complementary Metal Oxide Semicondu

文件：117.77 Kbytes 页数：19 Pages

恩XP

Class-AB stereo headphone driver

General description The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump wafer level chip-size package (WLCSP8). The device is fabricated in a 1µm Complementary Metal Oxide Semicondu

文件：117.77 Kbytes 页数：19 Pages

恩XP

音频放大器

恩XP

恩智浦