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零件编号	下载订购	功能描述/丝印	制造商上传企业	LOGO
281-1AB	文件：8.04467 Mbytes Page：21 Pages	BOARDLEVELPOWERSEMICONDUCTORHEATSINKS •Nointerfacematerialisneeded •Copperwithmattetinplatingforimprovedsolderabilityandassembly •BoththecomponentandtheheatsinkareinstalledonthePC-boardutilizing standardSMTassemblyequipmentfor”Tape&Reel”and“Tube”formats •EIAstandardsandESDprotectionares	ETCList of Unclassifed Manufacturers 未分类制造商	ETC

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功能描述/丝印

制造商上传企业

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281-1AB

文件：8.04467 Mbytes

Page：21 Pages

BOARDLEVELPOWERSEMICONDUCTORHEATSINKS

•Nointerfacematerialisneeded •Copperwithmattetinplatingforimprovedsolderabilityandassembly •BoththecomponentandtheheatsinkareinstalledonthePC-boardutilizing standardSMTassemblyequipmentfor”Tape&Reel”and“Tube”formats •EIAstandardsandESDprotectionares

ETCList of Unclassifed Manufacturers

未分类制造商

ETC

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