Telecommunications & Networking Devices

This family of telecommunication and networking devices was initially designed to meet the growing demand for resettable overcurrent protection. These product families help provide protection against damage caused by power cross and power induction surges as defined in ITU, Telcordia GR1089,

文件：327.17 Kbytes 页数：22 Pages

Littelfuse

力特

PolySwitch Resettable Devices Telecommunications & Networking Devices

This family of telecommunication and networking devices was initially designed over 10 years ago to meet the growing demand for resettable overcurrent protection. These product families help provide protection against damage caused by power cross and power induction surges as defined in ITU, Telco

文件：323.87 Kbytes 页数：22 Pages

MACOM

UNIVERSAL MICROPROCESSOR POWER SUPPLY/CONTROLLERS

Universal Microprocessor Power Supply/Controllers The TCA5600, TCF5600 are versatile power supply control circuits for microprocessor based systems and are mainly intended for automotive applications and battery powered instruments. To cover a wide range of applications, the devices offer high ci

文件：206.75 Kbytes 页数：12 Pages

Motorola

摩托罗拉

PERIPHERAL CLAMPING ARRAY

Peripheral Clamping Array The TCF6000 was designed to protect input/output lines of microprocessor systems against voltage transients. • Optimized for HMOS System • Minimal Component Count • Low Board Space Requirement • No P.C.B. Track Crossovers Required • Applications Areas Include Automo

文件：93.79 Kbytes 页数：6 Pages

Motorola

摩托罗拉

PERIPHERAL CLAMPING ARRAY

Peripheral Clamping Array The TCF6000 was designed to protect input/output lines of microprocessor systems against voltage transients. • Optimized for HMOS System • Minimal Component Count • Low Board Space Requirement • No P.C.B. Track Crossovers Required • Applications Areas Include Automo

文件：93.79 Kbytes 页数：6 Pages

Motorola

摩托罗拉

Engineering Specification

文件：593.54 Kbytes 页数：5 Pages

UNSEMI

优恩半导体

Engineering Specification

文件：600.69 Kbytes 页数：5 Pages

UNSEMI

优恩半导体

Engineering Specification

文件：557.23 Kbytes 页数：5 Pages

UNSEMI

优恩半导体

Engineering Specification

文件：554.93 Kbytes 页数：5 Pages

UNSEMI

优恩半导体

THIN FILM CHIP FUSE

文件：370.33 Kbytes 页数：3 Pages

AAC