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TC35661IDBG-009中文资料东芝数据手册PDF规格书
TC35661IDBG-009规格书详情
1. General Description
1.1. Product Concept
TC35661IDBG-009 is a 1-chip CMOS IC for Bluetooth® communication, which includes an RF analog part and a Baseband digital
part. TC35661 provides Bluetooth® HCI (Host Control Interface) function specified in Bluetooth® Core Specifications, EDR function,
and LE (Low Energy) function. Bluetooth® application is easily realized when TC35661 is connected to an external host processor
and Bluetooth® profile/stack and signal procedure are executed.
1.2. Features
Compliant with Bluetooth® Ver4.2
Built-in Bluetooth® baseband digital core
Built-in Bluetooth® RF analog core
Built-in PLL for multi-clock input
Built-in ARM7TDMI-STM core
On-chip Program Mask-ROM for Bluetooth® communication
On-chip Work memory (RAM) for Bluetooth® Baseband procedure
Supports patch program loader function
Supports a CODEC for audio communication
CVSD (Continuous Variable Slope Delta Modulation) CODEC
PCM (Pulse Code Modulation) CODEC
mSBC for WBS (Wide Band Speech)
Connectable Serial Flash ROM/ EEPROM at external serial memory interface
Serial Flash ROM interface (SPI)
EEPROM interface (I2C/SPI)
Host Interface (set for the product test.)
UART interface: Baud rate from 2400 bps to 4.33 Mbps
Voice/Audio CODEC Digital Interface (1-ch)
Supports I2S (The Inter-IC Sound Bus) interface
Left-justified interface
Supports PCM (Pulse Code Modulation) digital interface
General Purpose I/O (GPIO) with pull-up and pull-down resistors (MAX: 19 ports)
Wake-up Interface
Wake-up input function and remote wake-up output function
Wi-Fi co-existence interface (2-wire, 3-wire and 4-wire)
Test Interface
JTAG Interface (ICE Interface)
Supports OSC (Crystal oscillator: 26 MHz)
Supports an external clock input
Built-in oscillation circuit for an external crystal oscillator
Supports a sleep clock
Built-in divider for the reference operation clock
Supports an external clock input
Built-in sleep function
Power Supply: Single 3.3 V
Package
P-LFBGA64-0707-0.80-001 [64 balls, 7x7 mm, 0.8 mm pitch, and 1.4 mm height]
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TOSHIBA/东芝 |
24+ |
BGA |
22500 |
原装现货假一赔十 |
询价 | ||
TOSHIBA |
21+ |
TFBGA64 |
3395 |
只做原装正品,不止网上数量,欢迎电话微信查询! |
询价 | ||
TOSHIBA(东芝) |
23+ |
NA |
20094 |
正纳10年以上分销经验原装进口正品做服务做口碑有支持 |
询价 | ||
- |
23+ |
NA |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
询价 | ||
TOS |
1822+ |
TFBGA64 |
9852 |
只做原装正品假一赔十为客户做到零风险!! |
询价 | ||
TOSHIBA |
NA |
16355 |
一级代理 原装正品假一罚十价格优势长期供货 |
询价 | |||
TOSHIBA/东芝 |
24+ |
FBGA64 |
6000 |
原装房间现货可出样品 |
询价 | ||
TOSHIBA/东芝 |
2015 |
FBGA64 |
6000 |
原装现货 |
询价 | ||
TOSHIBA |
17+ |
TFBGA64 |
6200 |
100%原装正品现货 |
询价 | ||
Toshiba Semiconductor and Stor |
22+ |
64FBGA |
9000 |
原厂渠道,现货配单 |
询价 |