TAS5631BPHD.A中文资料德州仪器数据手册PDF规格书

1FEATURES

23. PurePath™ HD Enabled Integrated Feedback

Provides:

. Signal Bandwidth up to 80 kHz for High-

Frequency Content From HD Sources

. Ultralow 0.03% THD at 1 W Into 4 Ω

. Flat THD at All Frequencies for Natural

Sound

. 80-dB PSRR (BTL, No Input Signal)

. >100-dB (A-weighted) SNR

. Click- and Pop-Free Start-Up

. Multiple Configurations Possible on the Same

PCB With Stuffing Options:

. Mono Parallel Bridge-Tied Load (PBTL)

. Stereo Bridge-Tied Load (BTL)

. 2.1 Single-Ended Stereo Pair and Bridge-

Tied Load Subwoofer

. Quad Single-Ended Outputs

. Total Output Power at 10% THD+N

. 400 W per Channel in Mono PBTL

Configuration

. 300 W per Channel in Stereo BTL

Configuration

. 145 W per Channel in Quad Single-Ended

Configuration

. High-Efficiency Power Stage (>88%) With 60-

mΩ Output MOSFETs

. Two Thermally Enhanced Package Options:

. PHD (64-Pin QFP)

. DKD (44-Pin PSOP3)

. Self-Protection Design (Including

Undervoltage, Overtemperature, Clipping, and

Short-Circuit Protection) With Error Reporting

. EMI Compliant When Used With

Recommended System Design

APPLICATIONS

• Mini Combo System

• AV Receivers

• DVD Receivers

• Active Speakers

DESCRIPTION

The TAS5631B is a high-performance PWM input

class-D amplifier with integrated closed-loop

feedback technology (known as PurePath HD technology) with the ability to drive up to 300 W (1)

stereo into 4-Ω to 8-Ω speakers from a single 50-V

supply.

PurePath HD technology enables traditional AB-

amplifier performance (<0.03% THD) levels while

providing the power efficiency of traditional class-D

amplifiers.

Unlike traditional class-D amplifiers, the distortion

curve does not increase until the output levels move

into clipping. PurePath HD™

PurePath HD technology enables lower idle losses, making the device even more efficient.

Note 1. Achievable output power levels are

dependent on the thermal configuration of the target

application. A high-performance thermal interface

material between the package exposed heat slug

and the heat sink should be used to achieve high

output-power levels.