Max. load 8,000N (push); 3,000N (pull)

General Features Max. load 8,000N (push); 3,000N (pull) Max. speed at max. load 3.7mm/s Max. speed at no load 26.6mm/s Retracted length ≥ Stroke + 157mm IP rating IP66W Certificate IEC60601-1, ES60601-1, IEC60601-1-2 Stroke 25~450mm Output signals Hall sensors Options Safety nut Voltage

文件：1.11089 Mbytes 页数：11 Pages

TIMOTION

Reconfigurable FPGA with 16 x 16 bit Analog Input and 16 x 16 bit Analog Output

Application Information The TPCE636 is a half-length X4 PCIe compatible module providing a user configurable Kintex7 FPGA with 16 ADC input channels and 16 DAC output channels. The TPCE636 ADC input channels are based on the Linear Dual 16-Bit 5Msps Differential LTC2323-16 ADC. The TPCE636

文件：258.649 Kbytes 页数：3 Pages

TEWS

Reconfigurable FPGA with 24 x 16 bit Analog Input

Application Information The TXMC638 is a standard single-width Switched Mezzanine Card (XMC) compatible module providing a user configurable Kintex-7 FPGA with 24 ADC input channels. The TXMC638 ADC input channels are based on the Linear Dual 16-Bit 5Msps Differential LTC2323-16 ADCs. Each of th

文件：288.93 Kbytes 页数：3 Pages

TEWS

TELEPHONE TONE RINGER

TELEPHONE TONE RINGER DESCRIPTION The UTC TA31002is a bipolar integrated circuit designed for telephone bell replacement. It can also be used as alarms or other alerting devices. „ FEATURES * Current consumption is small. (at no-load) * Package is compaction. (DIP-8 pin)

文件：67.77 Kbytes 页数：6 Pages

UTC

友顺

TELEPHONE TONE RINGER

TELEPHONE TONE RINGER DESCRIPTION The UTC TA31002is a bipolar integrated circuit designed for telephone bell replacement. It can also be used as alarms or other alerting devices. „ FEATURES * Current consumption is small. (at no-load) * Package is compaction. (DIP-8 pin)

文件：67.77 Kbytes 页数：6 Pages

UTC

友顺

TELEPHONE TONE RINGER

TELEPHONE TONE RINGER DESCRIPTION The UTC TA31002is a bipolar integrated circuit designed for telephone bell replacement. It can also be used as alarms or other alerting devices. „ FEATURES * Current consumption is small. (at no-load) * Package is compaction. (DIP-8 pin)

文件：67.77 Kbytes 页数：6 Pages

UTC

友顺

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

文件：129.94 Kbytes 页数：1 Pages

OHMITE

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

文件：129.94 Kbytes 页数：1 Pages

OHMITE

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

文件：129.94 Kbytes 页数：1 Pages

OHMITE

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

文件：129.94 Kbytes 页数：1 Pages

OHMITE