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TA307

4 Channel High Speed Synch/Asynch Serial Interface

ApplicationInformation TheTAMC863isastandardsingleMid-Size/Full-SizeAMC.1compliantmodulewithfourhighspeedserialdatacommunicationchannels. TheserialcommunicationcontrollerisimplementedinFPGAlogic,alongwithabusmastercapablePCIinterface,guaranteeinglongtermavai

TEWS

TEWS Technologies GmbH

TA307

MTCA.4 Rear-I/O μRTM for TAMC220

ApplicationInformation TheTAMC002-TMisastandardMid-Size/Full-SizeMTCA.4compliantMicroRearTransitionModulecompatibletotheTAMC220. TwoAirmaxVSconnectorsprovideaccesstoallIPI/OlinesoftheTAMC220.TheI/OlinesareroutedtothreeVHD68SCSI-Vconnectorsinthefrontpanel

TEWS

TEWS Technologies GmbH

TA307

AMC Carrier for 3 IndustryPacks®

ApplicationInformation TheTAMC200isastandarddoubleMid-Size/Full-SizeAMC.1(PCI-Express)compliantcarrierforuptothreesingle-sizeoronedouble-sizeandonesingle-sizeIndustryPack(IP)modulesusedtobuildmodular,flexibleandcosteffectiveI/Osolutionsforallkindsofapplicat

TEWS

TEWS Technologies GmbH

TA307

PMC-Carrier for AMC

ApplicationInformation TheTAMC260isastandardMid-Size/Full-SizeAMCmodulethatprovidesoneslotforasingle-widthPMCmoduleusedtobuildmodular,flexibleandcosteffectiveI/Osolutionsforapplicationsinprocesscontrol,medicalsystems,telecommunicationandtrafficcontrol. 32bi

TEWS

TEWS Technologies GmbH

TA307

Power Chip Resistors Thick Film on Alumina Substrate

ETC1List of Unclassifed Manufacturers

etc未分类制造商未分类制造商

TA307

High Power Density

OHMITEOHMITE MANUFACTURING COMPANY

欧敏欧敏电阻制造公司

TA307

Power Chip짰 Thick Film on Alumina Substrate

OHMITEOHMITE MANUFACTURING COMPANY

欧敏欧敏电阻制造公司

TA307PA4K50FE

Power Chip Thick Film on Alumina Substrate

PowerChip®ThickFilmonAluminaSubstrate Ohmite’soriginalPowerChipresistorsfeatureourthickfilmonaluminasubstratetechnology.Theseplanarpackagesyieldspacesaving,10W/in2powerdensitiesthatrequireover50lessboardspacethanotherradialpackages.Convectioncoolingismaxi

OHMITEOHMITE MANUFACTURING COMPANY

欧敏欧敏电阻制造公司

TA307PA4K50JE

Power Chip Thick Film on Alumina Substrate

PowerChip®ThickFilmonAluminaSubstrate Ohmite’soriginalPowerChipresistorsfeatureourthickfilmonaluminasubstratetechnology.Theseplanarpackagesyieldspacesaving,10W/in2powerdensitiesthatrequireover50lessboardspacethanotherradialpackages.Convectioncoolingismaxi

OHMITEOHMITE MANUFACTURING COMPANY

欧敏欧敏电阻制造公司

TA307PA4K50KE

Power Chip Thick Film on Alumina Substrate

PowerChip®ThickFilmonAluminaSubstrate Ohmite’soriginalPowerChipresistorsfeatureourthickfilmonaluminasubstratetechnology.Theseplanarpackagesyieldspacesaving,10W/in2powerdensitiesthatrequireover50lessboardspacethanotherradialpackages.Convectioncoolingismaxi

OHMITEOHMITE MANUFACTURING COMPANY

欧敏欧敏电阻制造公司

详细参数

  • 型号:

    TA307

  • 功能描述:

    Power Chip Resistors Thick Film on Alumina Substrate

供应商型号品牌批号封装库存备注价格
TOSHIBA/东芝
23+
SOP
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
24+
3000
自己现货
询价
UTC
1822+
DIP-8
9852
只做原装正品假一赔十为客户做到零风险!!
询价
UTC
18+
DIP-8
41200
原装正品,现货特价
询价
TOSHIBA
24+
DIP
4897
绝对原装!现货热卖!
询价
东芝
22+
NA
500000
万三科技,秉承原装,购芯无忧
询价
TOSHIBA/东芝
23+
SOP
50000
全新原装正品现货,支持订货
询价
TOSHIBA
22+
SOP
3000
原装正品,支持实单
询价
TOSHIBA/东芝
24+
NA/
5358
原厂直销,现货供应,账期支持!
询价
TOS
2025+
SOP
4365
全新原厂原装产品、公司现货销售
询价
更多TA307供应商 更新时间2025-6-8 11:09:00