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TA3025PA4K50KE

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

文件:129.94 Kbytes 页数:1 Pages

OHMITE

TA3025PA4K50FE

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

文件:129.94 Kbytes 页数:1 Pages

OHMITE

TA3025PA4K50JE

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

文件:129.94 Kbytes 页数:1 Pages

OHMITE

TA31136FNG

SSOP16

TA31136FNG

SSOP

TOSHIBA/东芝

供应商型号品牌批号封装库存备注价格
OHMITE
23+
NA
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
25+
SO-8
7500
十年品牌!原装现货!!!
询价
TOSHIBA
24+
SO-8
626
询价
8243
原装现货
询价
24+
N/A
56000
一级代理-主营优势-实惠价格-不悔选择
询价
MORNSUN
23+
2000
金升阳代理
询价
金升阳
900
询价
MORNSUN
2450+
DIP
6540
只做原厂原装正品终端客户免费申请样品
询价
更多TA3025PA4K50KE供应商 更新时间2025-10-19 11:10:00