TA2100PA4K50FE中文资料欧敏数据手册PDF规格书

Power Chip® Thick Film on Alumina Substrate

Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maximized by the planar package configuration which dissipates heat well above board level.

Ohmite’s power chip resis tors have a 125 higher operating temperature range than competitive product of similar design. High temperature solder and in-process plating keep terminations secure under self-heating effects by preventing re-flow from full power operation.

Flexible packaging schemes make these resistors ideal for power supplies, audio amplifiers, video fly-back, and other power control applications.

FeATureS

• High-Temp Terminal Construction

• Wide Resistance Range

• Low Inductance (50nH-100nH)

• High Power Density

• Easy to install. PC-mountable