丝印：T2452V；Package：SOIC；THVD24xxV ±70V Fault-Protected 3V to 5.5V RS-485 Transceivers with Flexible I/O Supply and IEC ESD

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • 3V to 5.5V RS-485 supply voltage • Differential output exceeds 2.1V for PROFIBUS compatibility with 5V supply • 1.65V to 5.5V Supply for logic signal interface • SLR Pin Selectable Data Rates:

文件：2.24887 Mbytes 页数：40 Pages

TI

德州仪器

丝印：T2452V；Package：SOIC；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：2.02953 Mbytes 页数：40 Pages

TI

德州仪器

丝印：T2452V；Package：SOIC；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：1.91582 Mbytes 页数：37 Pages

TI

德州仪器

丝印：T2452V；Package：SOIC；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：2.02953 Mbytes 页数：40 Pages

TI

德州仪器

丝印：T2452V；Package：SOIC；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：1.91582 Mbytes 页数：37 Pages

TI

德州仪器

丝印：T2452V；Package：SOIC；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：2.02953 Mbytes 页数：40 Pages

TI

德州仪器

丝印：T2452V；Package：SOIC；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：1.91582 Mbytes 页数：37 Pages

TI

德州仪器

丝印：T2452V；Package：SOIC；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：2.02953 Mbytes 页数：40 Pages

TI

德州仪器

丝印：T2452V；Package：SOIC；THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

文件：2.02953 Mbytes 页数：40 Pages

TI

德州仪器