丝印：T1123L；Package：DSBGA；TIOL112 and TIOL112x IO-Link Device Transceivers with Low Residual Voltage and Integrated Surge Protection in Small Packages

1 Features • 7-V to 36-V supply voltage • PNP, NPN or IO-Link configurable output – IEC 61131-9 COM1, COM2 and COM3 Data Rate Support • Functional safety-capable – Documentation available to aid in functional safety system design • Pin-compatible with TIOL111(x) with improved performance

文件：2.10119 Mbytes 页数：35 Pages

TI

德州仪器

丝印：T1123L；Package：DSBGA；TIOL112 and TIOL112x IO-Link Device Transceivers with Low Residual Voltage and Integrated Surge Protection in Small Packages

1 Features • 7-V to 36-V supply voltage • PNP, NPN or IO-Link configurable output – IEC 61131-9 COM1, COM2 and COM3 Data Rate Support • Functional safety-capable – Documentation available to aid in functional safety system design • Pin-compatible with TIOL111(x) with improved performance

文件：2.42645 Mbytes 页数：38 Pages

TI

德州仪器

Silicon PIN Photodiode

Package type: chip\nPackage form: single chip\nDimensions (L x W x H in mm): 2.37 x 2.37 x 0.28;

Vishay

威世科技

RJ45+Transformer 沉板 TAB-UP 1000BASE DIP

CND-TEK

磁联达

XFMR,OCT,T1,TOU,1:2CT,1CT: RPB

PULSE

普思

包装：散装 类别：连接器，互连器件 重载连接器外壳、盖罩、基底 描述：T1120165121-000

TE Connectivity AMP Connectors

包装：散装 类别：连接器，互连器件 重载连接器外壳、盖罩、基底 描述：T1120165121-001

TE Connectivity AMP Connectors

包装：散装 类别：连接器，互连器件 重载连接器外壳、盖罩、基底 描述：T1120165121-001

TE Connectivity AMP Connectors