802.11a/b/g/n/ac plus Bluetooth SDIO System-in-Package (SiP) Module

Key Features: • Low Power Dual-Band 1x1 SiP Module for Wi-Fi & BT • Based on the QCA9377 Chipset • 802.11 a/b/g/n/ac Wave 2 MU-MIMO • SDIO 3.0 WLAN Host Interface • UART/PCM BT Interface • On-chip Power Management Unit (PMU) • Single 3.3V Supply (I/O Supply 1.8V or 3.3V) • Internal 48 MHz

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SILEX

silex technology america, Inc.

802.11a/b/g/n/ac SDIO System-in-Package (SiP)

The SX-SDPAC is a dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth 5.0+HS “Smart Ready” SDIO SiP module specifically designed for low-cost high volume embedded applications. • Ideal for high-volume, low-cost applications\n• Reference design to reduce certification costs\n;

Silex

BGA

IDT

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