IEEE 802.11 a/b/g/n/ac Plus Bluetooth SDIO Wi-Fi Module

Features • Powered by QCA9379-3 Chip by Qualcomm • Dual Band Support for both 2.4GHz / 5GHz • 2x2 MU-MIMO Support • PHY Data Rate up to 867 Mbps (11ac VHT80) • Bluetooth v5.0 • Host Interface - WLAN : SDIO3.0 - Bluetooth : UART • RoHS Compliant • Modular Certifications for North America,

文件：2.86748 Mbytes 页数：2 Pages

SILEX

silex technology america, Inc.

IEEE 802.11 a/b/g/n/ac Plus Bluetooth SDIO Wi-Fi Module

Features • Powered by QCA9379-3 Chip by Qualcomm • Dual Band Support for both 2.4GHz / 5GHz • 2x2 MU-MIMO Support • PHY Data Rate up to 867 Mbps (11ac VHT80) • Bluetooth v5.0 • Host Interface - WLAN : SDIO3.0 - Bluetooth : UART • RoHS Compliant • Modular Certifications for North America,

文件：2.86748 Mbytes 页数：2 Pages

SILEX

silex technology america, Inc.

IEEE 802.11 a/b/g/n/ac Plus Bluetooth SDIO Wi-Fi Module

Features • Powered by QCA9379-3 Chip by Qualcomm • Dual Band Support for both 2.4GHz / 5GHz • 2x2 MU-MIMO Support • PHY Data Rate up to 867 Mbps (11ac VHT80) • Bluetooth v5.0 • Host Interface - WLAN : SDIO3.0 - Bluetooth : UART • RoHS Compliant • Modular Certifications for North America,

文件：2.86748 Mbytes 页数：2 Pages

SILEX

silex technology america, Inc.

BGA

IDT

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