Surface mount resin molded, Ultra miniaturized chip

The SVS series is a line-up of high performance ultra miniaturized tantalum chip capacitors. The case dimensions are 2.0 mm × 1.25 mm × 1.2 mm as shown below. FEATURES ○ The smallest molded chip tantalum capacitor (half size of the EIA standard A case) ○ Available up to 10 µF with case dimensi

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NEC

瑞萨

Surface mount resin molded, Ultra miniaturized chip

The SVS series is a line-up of high performance ultra miniaturized tantalum chip capacitors.\nThe case dimensions are 2.0 mm × 1.25 mm × 1.2 mm as shown below.FEATURES\n• The smallest molded chip tantalum capacitor (half size of the EIA standard A case)\n• Available up to 10 µF with case dimension o • The smallest molded chip tantalum capacitor (half size of the EIA standard A case)\n• Available up to 10 µF with case dimension of 2.0 mm × 1.25 mm × 1.2 mm (case code P);

Renesas

瑞萨

SILAN/士兰微
TO-220F

SILAN/士兰微

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