STM32MP157F数据手册开发板套件编程器的评估板-嵌入式-MCUDSP规格书PDF

描述 Description

The STM32MP157C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.

The STM32MP157C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.

The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.

All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

特性 Features

• 内核
•32-bit dual-core Arm® Cortex®-A7
• L1 32-Kbyte I / 32-Kbyte D for each core
• 256-Kbyte unified level 2 cache
• Arm® NEON™ and Arm® TrustZone®

•32-bit Arm® Cortex®-M4 with FPU/MPU
• Up to 209 MHz (Up to 703 CoreMark®)

• Memories
•External DDR memory up to 1 Gbyte
• up to LPDDR2/LPDDR3-1066 16/32-bit
• up to DDR3/DDR3L-1066 16/32-bit

•708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
•Dual mode Quad-SPI memory interface
•Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
• Security/safety
•Secure boot, TrustZone® peripherals, active tamper
•Cortex®-M4 resources isolation
• Reset and power management
•1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
•POR, PDR, PVD and BOR
•On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
•Backup regulator (~0.9 V)
•Internal temperature sensors
•Low-power modes: Sleep, Stop and Standby
•DDR memory retention in Standby mode
•Controls for PMIC companion chip
• Low-power consumption
•Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
• Clock management
•Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
•External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
•6 × PLLs with fractional mode
• General-purpose input/outputs
•Up to 176 I/O ports with interrupt capability
• Up to 8 secure I/Os
• Up to 6 Wakeup, 3 tampers, 1 active tamper

• Interconnect matrix
•2 bus matrices
• 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
• 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz

• 3 DMA controllers to unload the CPU
•48 physical channels in total
•1 × high-speed general-purpose master direct memory access controller (MDMA)
•2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
• Up to 37 communication peripherals
•6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
•4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
•6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
•4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
•SPDIF Rx with 4 inputs
•HDMI-CEC interface
•MDIO Slave interface
•3 × SDMMC up to 8-bit (SD / e•MMC™/ SDIO)
•2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
•2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
• or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously

•10/100M or Gigabit Ethernet GMAC
• IEEE 1588v2 hardware, MII/RMII/GMII/RGMII

•8- to 14-bit camera interface up to 140 Mbyte/s
• 6 analog peripherals
•2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
•1 × temperature sensor
•2 × 12-bit D/A converters (1 MHz)
•1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
•Internal or external ADC/DAC reference VREF+
• Graphics
•3D GPU: Vivante® - OpenGL® ES 2.0
• Up to 26 Mtriangle/s, 133 Mpixel/s

•LCD-TFT controller, up to 24-bit // RGB888
• up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 × 1080) @30 fps
• Pixel clock up to 90 MHz
• Two layers with programmable colour LUT

•MIPI® DSI 2 data lanes up to 1 GHz each
• Up to 29 timers and 3 watchdogs
•2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
•2 × 16-bit advanced motor control timers
•10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
•5 × 16-bit low-power timers
•RTC with sub-second accuracy and hardware calendar
•2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
•1 × SysTick M4 timer
•3 × watchdogs (2 × independent and window)
• Hardware acceleration
•AES 128, 192, 256, TDES
•HASH (MD5, SHA-1, SHA224, SHA256), HMAC
•2 × true random number generator (3 oscillators each)
•2 × CRC calculation unit
• Debug mode
•Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
•8-Kbyte embedded trace buffer
• 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
• All packages are ECOPACK2 compliant

简介

STM32MP157F属于开发板套件编程器的评估板-嵌入式-MCUDSP。由制造生产的STM32MP157F评估板 - 嵌入式 - MCU，DSP该系列产品提供了一种方便的方法，在经过验证的硬件实施环境中评估微控制器、微处理器和数字信号处理器元器件的性能或特性。所包括的产品因预期用例各异，范围可能从旨在方便评估的未填充 PCB 到各种微控制器系列，再到具有广泛外设支持的单板计算机。