STM32H7A3IG中文资料意法半导体数据手册PDF规格书

Features

Includes ST state-of-the-art patented technology

Core

• 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache:

16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache

line in a single access from the 128-bit embedded flash memory; frequency up

to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP

instructions

Memories

• Up to 2 Mbytes of flash memory with read while write support, plus 1 Kbyte of

OTP memory

• ~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM +

128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM,

and 4 Kbytes of SRAM in Backup domain

• 2x Octo-SPI memory interfaces, I/O multiplexing and support for serial PSRAM/

NOR, Hyper RAM/flash frame formats, running up to 140 MHz in SRD mode and

up to 110 MHz in DTR mode

• Flexible external memory controller with up to 32-bit data bus:

– SRAM, PSRAM, NOR flash memory clocked up to 125 MHz in

Synchronous mode

– SDRAM/LPSDR SDRAM

– 8/16-bit NAND flash memories

• CRC calculation unit

Security

• ROP, PC-ROP, active tamper, secure firmware upgrade support

General-purpose input/outputs

• Up to 168 I/O ports with interrupt capability

– Fast I/Os capable of up to 133 MHz

– Up to 164 5-V-tolerant I/Os

Low-power consumption

• Stop: down to 32 μA with full RAM retention

• Standby: 2.8 μA (Backup SRAM OFF, RTC/LSE ON, PDR OFF)

• VBAT: 0.8 μA (RTC and LSE ON)

Clock management

• Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI

• External oscillators: 4-50 MHz HSE, 32.768 kHz LSE

• 3× PLLs (1 for the system clock, 2 for kernel clocks) with fractional mode

Reset and power management

• 2 separate power domains, which can be independently clock gated to maximize power efficiency:

– CPU domain (CD) for Arm® Cortex® core and its peripherals, which can be independently switched in

Retention mode

– Smart run domain (SRD) for reset and clock control, power management and some peripherals

• 1.62 to 3.6 V application supply and I/Os

• POR, PDR, PVD and BOR

• Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs

• Dedicated SDMMC power supply

• High power efficiency SMPS step-down converter regulator to directly supply VCORE or an external circuitry

• Embedded regulator (LDO) with configurable scalable output to supply the digital circuitry

• Voltage scaling in Run and Stop mode

• Backup regulator (~0.9 V)

• Low-power modes: Sleep, Stop and Standby

• VBAT battery operating mode with charging capability

• CPU and domain power state monitoring pins

Interconnect matrix

• 3 bus matrices (1 AXI and 2 AHB)

• Bridges (5× AHB2APB, 3× AXI2AHB)

5 DMA controllers to unload the CPU

• 1× high-speed general-purpose master direct memory access controller (MDMA)

• 2× dual-port DMAs with FIFO and request router capabilities

• 1× basic DMA with request router capabilities

• 1x basic DMA dedicated to DFSDM

Up to 35 communication peripherals

• 4× I2C FM+ interfaces (SMBus/PMBus)

• 5× USART/5x UARTs (ISO7816 interface, LIN, IrDA, modem control) and 1x LPUART

• 6× SPIs, including 4 with muxed full-duplex I2S audio class accuracy via internal audio PLL or external clock

and 1 x SPI/I2S in LP domain (up to 125 MHz)

• 2x SAIs (serial audio interface)

• SPDIFRX interface

• SWPMI single-wire protocol master interface

• MDIO Slave interface

• 2× SD/SDIO/MMC interfaces (up to 133 MHz)

• 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)

• 1× USB OTG interfaces (1HS/FS)

• HDMI-CEC

• 8- to 14-bit camera interface up to 80 MHz

• 8-/16-bit parallel synchronous data input/output slave interface (PSSI)

11 analog peripherals

• 2× ADCs with 16-bit max. resolution (up to 24 channels, up to 3.6 MSPS)

• 1× analog and 1x digital temperature sensors

• 1× 12-bit single-channel DAC (in SRD domain) + 1× 12-bit dual-channel DAC

• 2× ultra-low-power comparators

• 2× operational amplifiers (8 MHz bandwidth)

• 2× digital filters for sigma delta modulator (DFSDM), 1x with 8 channels/8 filters and 1x in SRD domain with 2

channels/1 filter

Graphics

• LCD-TFT controller up to XGA resolution

• Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load

• Hardware JPEG Codec

• Chrom-GRC™ (GFXMMU)

Up to 19 timers and 2 watchdogs

• 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to

280 MHz)

• 2× 16-bit advanced motor control timers (up to 280 MHz)

• 10× 16-bit general-purpose timers (up to 280 MHz)

• 3× 16-bit low-power timers (up to 280 MHz)

• 2× watchdogs (independent and window)

• 1× SysTick timer

• RTC with sub-second accuracy and hardware calendar

Debug mode

• SWD and JTAG interfaces

• 4 KB Embedded Trace Buffer

1x 32-bit, NIST SP 800-90B compliant, true random generator

96-bit unique ID

All packages are ECOPACK2 compliant

Description

STM32H7A3xI/G devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at

up to 280 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision

(IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H7A3xI/G devices

support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H7A3xI/G devices incorporate high-speed embedded memories with a dual-bank flash memory of up

to 2 Mbytes, around 1.4 Mbyte of RAM (including 192 Kbytes of TCM RAM, 1.18 Mbytes of user SRAM and

4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to four

APB buses, three AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal

and external memory access.

All the devices offer two ADCs, two DACs (one dual and one single DAC), two ultra-low power comparators, a

low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, three low-power timers, a

true random number generator (RNG). The devices support nine digital filters for external sigma delta modulators

(DFSDM). They also feature standard and advanced communication interfaces.

• Standard peripherals

– Four I2Cs

– Five USARTs, five UARTs and one LPUART

– Six SPIs, four I2Ss in full-duplex mode. To achieve audio class accuracy, the I2S peripherals can be

clocked via a dedicated internal audio PLL or via an external clock to allow synchronization.

– Two SAI serial audio interfaces, out of which one with PDM

– One SPDIFRX interface

– One single wire protocol master interface (SWPMI)

– One 16-bit parallel synchronous slave interface (PSSI) sharing the same interface as the digital

camera)

– Management Data Input/Output (MDIO) slaves

– Two SDMMC interfaces (one can be supplied from a supply voltage separate from that of all other I/Os)

– A USB OTG high-speed with full-speed capability (with the ULPI)

– One FDCAN plus one TT-CAN interface

– Chrom-ART Accelerator

– HDMI-CEC

• Advanced peripherals including

– A flexible memory control (FMC) interface

– Two octo-SPI memory interface

– A digital camera interface for CMOS sensors (DCMI)

– A graphic memory management unit (GFXMMU)

– An LCD-TFT display controller (LTDC)

– A JPEG hardware compressor/decompressor

Refer to Table 1. STM32H7A3xI/G features and peripheral counts for the list of peripherals available on each part

number.

STM32H7A3xI/G devices operate in the –40 to +85 °C ambient temperature range from a 1.62 to 3.6 V

power supply. The supply voltage can drop down to 1.62 V by using an external power supervisor (see

Section 3.5.2 Power supply supervisor) and connecting the PDR_ON pin to VSS. Otherwise the supply voltage

must stay above 1.71 V with the embedded power voltage detector enabled.

The USB OTG_HS/FS interfaces can be supplied either by the integrated USB regulator or through a separate

supply input.

A dedicated supply input is available for one of the SDMMC interface for package with more than 100 pins. It

allows running from a different voltage level than all other I/Os.

A comprehensive set of power-saving mode allows the design of low-power applications.

The CPU and domain states can be directly monitored on some GPIOs configured as alternate functions.

STM32H7A3xI/G devices are offers in several packages ranging from 64 pins to 225 pins/balls. The set of

included peripherals changes with the device chosen.

These features make the STM32H7A3xI/G microcontrollers suitable for a wide range of applications:

• Motor drive and application control

• Medical equipment

• Industrial applications: PLC, inverters, circuit breakers

• Printers, and scanners

• Alarm systems, video intercom, and HVAC

• Home audio appliances

• Mobile applications, Internet of Things

• Wearable devices: smart watches.

Figure 1. STM32H7A3xI/G block diagram shows the general block diagram of the device family.