STM32F401RB数据手册ST中文资料规格书

描述 Description

The STM32F401xB/STM32F401xC devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 84 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32F401xB/STM32F401xC incorporate high-speed embedded memories (up to 256 Kbytes of Flash memory, up to 64 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.

All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.

The STM32F401xB/STM32F401xC operate in the - 40 to + 125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.

These features make the STM32F401xB/STM32F401xC microcontrollers suitable for a wide range of applications.

特性 Features

• Dynamic efficiency line with BAM (batch acquisition mode)
•1.7 V to 3.6 V power supply
•-40 °C to 85/105/125 °C temperature range
• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 84 MHz, memory protection unit, 105 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
•Up to 256 Kbytes of Flash memory
•512 bytes of OTP memory
•Up to 64 Kbytes of SRAM
• Clock, reset and supply management
•1.7 V to 3.6 V application supply and I/Os
•POR, PDR, PVD and BOR
•4-to-26 MHz crystal oscillator
•Internal 16 MHz factory-trimmed RC
•32 kHz oscillator for RTC with calibration
•Internal 32 kHz RC with calibration
• Power consumption
•Run: 128 μA/MHz (peripheral off)
•Stop (Flash in Stop mode, fast wakeup time): 42 μA typ @ 25 °C;65 μA max @25 °C
•Stop (Flash in Deep power down mode, slow wakeup time): down to 10 μA typ@ 25 °C; 28 μA max @25 °C
•Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
•VBAT supply for RTC: 1 μA @25 °C
• 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
• General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
• Up to 11 timers: up to six 16-bit, two 32-bit timers up to 84 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer
• Debug mode
•Serial wire debug (SWD) & JTAG interfaces
•Cortex®-M4 Embedded Trace Macrocell™
• Up to 81 I/O ports with interrupt capability
•All IO ports 5 V tolerant
•Up to 78 fast I/Os up to 42 MHz
• Up to 11 communication interfaces
•Up to 3 × I2C interfaces (1Mbit/s, SMBus/PMBus)
•Up to 3 USARTs (2 x 10.5 Mbit/s, 1 x 5.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
•Up to 4 SPIs (up to 42 Mbits/s at fCPU= 84 MHz), SPI2 and SPI3 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock
•SDIO interface
• Advanced connectivity
•USB 2.0 full-speed device/host/OTG controller with on-chip PHY
• CRC calculation unit
• 96-bit unique ID
• RTC: subsecond accuracy, hardware calendar
• All packages are ECOPACK2