丝印：GIPS14K60T；Package：SDIP-25L；SLLIMM (small low-loss intelligent molded module) IPM

Features  IPM 14 A, 600 V 3-phase IGBT inverter bridge including control ICs for gate driving and freewheeling diodes  Short-circuit rugged IGBTs  VCE(sat) negative temperature coefficient  3.3 V, 5 V, 15 V CMOS/TTL inputs comparators with hysteresis and pull down / pull up resistors 

文件：880.49 Kbytes 页数：20 Pages

STMICROELECTRONICS

意法半导体

Undervoltage lockout

文件：678.37 Kbytes 页数：19 Pages

STMICROELECTRONICS

意法半导体

SLLIMM small low-loss intelligent molded module IPM, 3-phase inverter, 14 A, 600 V short-circuit rugged IGBT

This intelligent power module provides a compact, high performance AC motor drive in a simple, rugged design. Combining ST proprietary control ICs with the most advanced short-circuit-rugged IGBT system technology, this device is ideal for 3-phase inverters in applications such as home appliances an • IPM 14 A, 600 V 3-phase IGBT inverter bridge including control ICs for gate driving and free-wheeling diodes\n• VCE(sat)negative temperature coefficient\n• Undervoltage lockout\n• Interlocking function\n• DBC substrate leading to low thermal resistance\n• 4.7 kΩ NTC for temperature control\n• UL R;

ST

意法半导体

Package：25-PowerDIP 模块（0.993"，25.23mm）；包装：卷带（TR） 类别：分立半导体产品 功率驱动器模块 描述：MOD IPM 600V 14A 25-SDIP

STMICROELECTRONICS

意法半导体

SLLIMM small low-loss intelligent molded module IPM, 3-phase inverter, 14 A, 600 V short-circuit rugged IGBT

This intelligent power module provides a compact, high performance AC motor drive in a simple, rugged design. Combining ST proprietary control ICs with the most advanced short-circuit-rugged IGBT system technology, this device is ideal for 3-phase inverters in applications such as home appliances an • IPM 14 A, 600 V 3-phase IGBT inverter bridge including control ICs for gate driving and free-wheeling diodes\n• Short-circuit rugged IGBTs\n• VCE(sat)negative temperature coefficient\n• 3.3 V, 5 V, 15 V CMOS/TTL inputs comparators with hysteresis and pull-down / pull-up resistors\n• Undervoltage l;

ST

意法半导体

Package：25-PowerDIP 模块（0.993"，25.23mm）；包装：散装 类别：分立半导体产品 功率驱动器模块 描述：MOD IGBT SLLIMM 14A 600V 25SDIP

STMICROELECTRONICS

意法半导体