STB6045C中文资料桑德斯微电子数据手册PDF规格书

特性 Features

 150'C TJ operation

 Ultralow forward voltage drop

 High purity, high temperature epoxy encapsulation for

enhanced mechanical strength and moisture resistance

 High frequency operation

 Trench MOS Schottky technology

 Terminals finish: 100 Pure Tin

 This is a Pb − Free Device

 All SMC parts are traceable to the wafer lot

 Additional testing can be offered upon request