ST4SIM-200M中文资料eSIM System on chip for M2M Industrial - eSIM GSMA SGP.02 v3.2 / GP v2.3 / ETSI Rel14 / Javacrd 3.0.4 Classic Edition数据手册ST规格书

描述 Description

The ST4SIM-200M is an STMicroelectronics top-class embedded SIM (eSIM or eUICC) product compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.
It can remotely manage profiles of different MNOs while ensuring the appropriate security level to all eUICC stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on). The ST4SIM-200M can include an embedded secure element to store credential and/or independent applications directly managed by the MCU (or by another OEM element). The ST4SIM-200M provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the ST4SIM-200M integrates the most advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP, 3GPP2 specifications. The ST4SIM-200M integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory. The ST4SIM-200M is based on a tamper-resistant secure element certified by Common criteria EAL5+, with a powerful 32-bit Arm® SecurCore® SC300™ RISC core.

特性 Features

•
•Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
•Bootstrap connectivity profile
•Up to 7 profiles (depending on memory size)
•Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
•Network access applications supported: SIM / USIM / ISIM / CSIM
•Secure element access control (ARF / PKCS#15)
•OTA capability over SMS, CAT-TP & HTTPS (including DNS)
•Multi-interfaces able to combine eSIM + eSE

• Hardware
•
•Product available on ST33G1M2M
•ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
•Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
•Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
•Serial Peripheral Interface (SPI), depending on packages
•Industrial qualification (JEDEC JESD47)
•Operating temperature: -40°C to +105°C
•Common Criteria EAL5+

• ECOPACK-compliant packages
•D16 micromodule
•DFN8 Wettable Flank (MFF2)
•WLCSP

• 安保
•Symmetric cryptography DES / 3DES / AES
•Asymmetric cryptography RSA (up to 2048 bits)
•HTTPS remote management TLS v1.0, v1.1 and v1.2
•Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpoolP256r1
•Authentication algorithm: MILENAGE, TUAK, CAVE

• Software standard compliancy
•GSMA SGP.02 v3.2
•SIMalliance interoperable profile v2.1
•Java Card™ v3.0.4 Classic
•GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
•ETSI, 3GPP and 3GPP2 release 12 (for further information, contact your local STMicroelectronics sales office)
•Power saving features (PSM and eDRX) defined by ETSI release 13

• Certification
•GlobalPlatform-certified \"Muse eUICC-i2 v1\" compliant with GSMA SGP.02 v3.2