首页>ST14C02C>规格书详情

ST14C02C中文资料意法半导体数据手册PDF规格书

ST14C02C
厂商型号

ST14C02C

功能描述

Memory Micromodules General Information for D1, D2 and C Packaging

文件大小

277.48 Kbytes

页面数量

13

生产厂商 STMicroelectronics
企业简称

STMICROELECTRONICS意法半导体

中文名称

意法半导体集团官网

原厂标识
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-7-3 18:29:00

人工找货

ST14C02C价格和库存,欢迎联系客服免费人工找货

ST14C02C规格书详情

DESCRIPTION

Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).

■ Micromodules were developed specifically for

embedding in Smartcards and Memory Cards

■ The Micromodule provides:

– Support for the chip

– Electrical contacts

– Suitable embedding interface for gluing the

module to the plastic package

■ Physical dimensions and contact positions

compliant to the ISO 7816 standard

■ Micromodules delivered as a continuous Super

35 mm tape. (This differs from the standard

35 mm tape in the spacing distance between

the indexing holes.)

产品属性

  • 型号:

    ST14C02C

  • 制造商:

    STMICROELECTRONICS

  • 制造商全称:

    STMicroelectronics

  • 功能描述:

    Memory Micromodules General Information for D1, D2 and C Packaging

供应商 型号 品牌 批号 封装 库存 备注 价格
GOOD
1611+
SMB
6300
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
XG
23+
DIP4
9600
十七年VIP会员,诚信经营,一手货源,原装正品可零售!
询价
GOOD
21+
SMB
6300
公司现货,不止网上数量!原装正品,假一赔十!
询价
XG
2017+
DIP-4
8598
只做原装正品假一赔十!
询价
EVERLIGHT
连接器
123500
一级代理 原装正品假一罚十价格优势长期供货
询价
GPY/XG
20+
DIP-4
88720
红外全新原装主营-可开原型号增税票
询价
XG
15+
DIP4
880000
明嘉莱只做原装正品现货
询价
XG/亿光
24+
NA/
200
优势代理渠道,原装正品,可全系列订货开增值税票
询价
XG
22+
DIP4
102656
原装正品现货,可开13点税
询价
XG/亿光
DIP4
3200
原装长期供货!
询价