SR20100LD1中文资料晶恒数据手册PDF规格书

FEATURES

• Power pack

• Metal silicon junction ,majority carrier conduction

• Guard ring for overvoltage protection

• Low power loss ,high efficiency

• High current capability ,low forward voltage drop

• High forward surge capability

• High frequency operation

• Meets MSL Level 1，per J-STD-020,LF MAX peak of 245℃（for TO-263 package）

• Solder bath temperature 275℃ maximum，10s，per JESD22-B106（for TO-220AB and ITO-220AB package）

• Component in accordance to RoHS 2011/65/EU