SPU16C SERIES

文件：330.2 Kbytes 页数：2 Pages

MPSIND

美国芯源

Chip Resistor Networks High speed mounting using conventional placing machine

■ Features ● High density placing for digital signal circuits · Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch EXBQ: 3.8 mm × 1.6 mm ×

文件：112.41 Kbytes 页数：2 Pages

Panasonic

松下

Chip Resistor Networks High speed mounting using conventional placing machine

■ Features ● High density placing for digital signal circuits · Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch EXBQ: 3.8 mm × 1.6 mm ×

文件：112.41 Kbytes 页数：2 Pages

Panasonic

松下

Chip Resistor Networks High speed mounting using conventional placing machine

■ Features ● High density placing for digital signal circuits · Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch EXBQ: 3.8 mm × 1.6 mm ×

文件：112.41 Kbytes 页数：2 Pages

Panasonic

松下