SPC5517EBMLQ66数据手册恩XP中文资料规格书

描述 Description

Designed for body electronics, the NXP® MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle.
Offers high-performance while continuing to meet low-power requirements
Enables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architectures
Provides extensive communication capabilities (e.g., FlexRay, multiple CAN and LIN support)
Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash
Backed by a third-party ecosystem of development tools and software

特性 Features

• Power Architecture e200z1 core with variable length encoding (VLE)
• Optional VLE-only 32/16-bit e200z0 secondary core
• 16-channel eDMA (enhanced direct memory access)
• Memory management unit (MMU) with 4-entry translation look-aside buffer (TLB)
• Multiple low-power modes
• JTAG and Nexus class 2+ debug support
• Up to 1.5 MB of flash with error correction coding (ECC)
• The flash module features read while write (RWW) and small partitions for optimal bootloader and EEPROM emulation support
• Up to 80 KB of SRAM with ECC
• Memory protection unit (MPU) with up to 16 regions and 32B granularity
• This product is included in NXP®.s product longevity program, with assured supply for a minimum of 15 years after launch