Intel® Xeon® D-2700 Processor (Ice Lake-D HCC) COM-HPC® Server Size D

Features ƒ COM-HPC® Server Size D Module ƒ Intel® Xeon® D-2700 processors (Ice Lake-D HCC) ƒ Up to 20 Cores, 30MB LLC Cache, 118W TDP ƒ Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC) ƒ 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB ƒ Supports iManager, Embedded

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AMD EPYC™ 7003 Processor COM-HPC® Server Size E module with proprietary pinout

Features ƒ COM-HPC® Server Size E module with proprietary pinout ƒ Up to 64C/225W AMD EYPC™ 7003 real server grade CPU with extreme performance ƒ Up to 512GB large memory size with 4x DDR4 long DIMM ƒ 79 PCIe Gen4 lanes (14 more than COM-HPC STD) ƒ Supports iManager, Embedded Software APIs,

文件：4.17837 Mbytes 页数：6 Pages

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TI Sitara™ ARM AM3352 Cortex -A8 1GHz RTX2.0 Module

Features ƒ TI Sitara™ ARM® AM3352 Cortex®-A8 1Ghz high performance processor ƒ On board DDR3 512MB memory / 4GB EMMC ƒ Supports wide range power input 5V~24V ƒ Supports 1 GbE, 1 USB 2.0, 1 USB 2.0 OTG, 2 CANbus, 10 GPIO, 4 UART, 1 I2C, 1 I2S, 1 SPI, 1 SDIO ƒ Operating temperature 0 ~ 60 °C /

文件：3.21724 Mbytes 页数：4 Pages

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恩XP ARM® Cortex®-A9 i.MX6 RTX v2.0 module

Features ƒ 恩XP ARM® Cortex®-A9 i.MX6 high performance processor ƒ Onbard DDR3 memory and eMMC 16GB ƒ Supports wide range power input 5V~24V ƒ Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators ƒ Supports full HD 1080p video decode and HD 1080p video encode hardware engine ƒ Support

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

文件：4.1535 Mbytes 页数：6 Pages

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

文件：4.1535 Mbytes 页数：6 Pages

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

文件：4.1535 Mbytes 页数：6 Pages

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

文件：4.1535 Mbytes 页数：6 Pages

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

文件：4.1535 Mbytes 页数：6 Pages

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

文件：4.1535 Mbytes 页数：6 Pages

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