9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

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MIL-Grade System Development Kit COM Express R3.0 Basic Module Type 6 MXM Graphic and IP67 Waterproof

Features ƒ Robust System Followed Open Standard VITA 75.0 ƒ Modular Structure Comes with COMe, Carrier, I/O and Power Modules ƒ MIL-DTL-38999 Circular Connectors with IP Waterproof ƒ Design to Meet MIL-STD 810, 461 and IPC-A-610 Class 3 ƒ Operating Temperature up to -40 ~ 55°C ƒ Wide Range P

文件：417.39 Kbytes 页数：2 Pages

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9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

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9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

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研华科技

9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

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研华科技

9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

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研华科技

9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

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研华科技

9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

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研华科技

9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

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研华科技

9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

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