SN74V263PZAEP资料datasheet下载批发供应TI-114ic电子网

型号	下载订购	功能描述	制造商上传企业	LOGO
SN74V263PZAEP	文件：766.64 Kbytes Page：50 Pages	丝印：V263EP；Package：LQFP；8192 × 18, 16384 × 18, 32768 × 18, 65536 × 18 3.3-V CMOS FIRST-IN, FIRST-OUT MEMORIES Controlled Baseline – One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† Choice of Memory Organizations – SN74V263 – 8192 × 1 文件：766.64 Kbytes 页数：50 Pages	TI 德州仪器	TI
SN74V263PZAEP	文件：702.42 Kbytes Page：49 Pages	3.3-V CMOS FIRST-IN, FIRST-OUT MEMORIES 文件：702.42 Kbytes 页数：49 Pages	TI 德州仪器	TI
SN74V263PZAEP.A	文件：766.64 Kbytes Page：50 Pages	丝印：V263EP；Package：LQFP；8192 × 18, 16384 × 18, 32768 × 18, 65536 × 18 3.3-V CMOS FIRST-IN, FIRST-OUT MEMORIES Controlled Baseline – One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† Choice of Memory Organizations – SN74V263 – 8192 × 1 文件：766.64 Kbytes 页数：50 Pages	TI 德州仪器	TI
SN74V263PZAEP	文件：100 bytes Page：1 Pages	Package：80-LQFP；包装：管件功能：同步类别：集成电路（IC） FIFO 存储器描述：IC SYNC FIFO 8KX18 80QFP	TI 德州仪器	TI

更多SN74V263PZAEP供应商更新时间2026-1-26 15:10:00