SN74LVT16240DL.B中文资料德州仪器数据手册PDF规格书

FEATURES

· Members of the Texas Instruments Widebus™

Family

· State-of-the-Art Advanced BiCMOS

Technology (ABT) Design for 3.3-V Operation

and Low Static-Power Dissipation

· Support Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V VCC)

· Support Unregulated Battery Operation Down

to 2.7 V

· Typical VOLP (Output Ground Bounce) <0.8 V

at VCC = 3.3 V, TA = 25°C

· Ioff and Power-Up 3-State Support Hot

Insertion

· Distributed VCC and GND Pins Minimize

High-Speed Switching Noise

· Flow-Through Architecture Optimizes PCB

Layout

· Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

· ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

· Package Options Include Plastic Shrink

Small-Outline (DL) and Thin Shrink

Small-Outline (DGG) Packages and 380-mil

Fine-Pitch Ceramic Flat (WD) Package Using

25-mil Center-to-Center Spacings

DESCRIPTION/ORDERING INFORMATION

SN54LVT16240, SN74LVT16240

3.3-V ABT 16-BIT BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCBS717A–APRIL 2000–REVISED NOVEMBER 2006

· Members of the Texas Instruments Widebus™

Family

· State-of-the-Art Advanced BiCMOS

Technology (ABT) Design for 3.3-V Operation

and Low Static-Power Dissipation

· Support Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V VCC)

· Support Unregulated Battery Operation Down

to 2.7 V

· Typical VOLP (Output Ground Bounce) <0.8 V

at VCC = 3.3 V, TA = 25°C

· Ioff and Power-Up 3-State Support Hot

Insertion

· Distributed VCC and GND Pins Minimize

High-Speed Switching Noise

· Flow-Through Architecture Optimizes PCB

Layout

· Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

· ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

· Package Options Include Plastic Shrink

Small-Outline (DL) and Thin Shrink

Small-Outline (DGG) Packages and 380-mil

Fine-Pitch Ceramic Flat (WD) Package Using

25-mil Center-to-Center Spacings

The 'LVT16240 devices are 16-bit buffers and line drivers designed specifically for low-voltage (3.3-V) VCC

operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices are designed specifically to improve both the performance and density of 3-state memory

address drivers, clock drivers, and bus-oriented receivers and transmitters.

The devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide

inverting outputs and symmetrical active-low output-enable (OE) inputs.

When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.

However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;

the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry

disables the outputs, preventing damaging current backflow through the devices when they are powered down.

The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,

which prevents driver conflict.