SN74LVC2G06DSFRG4.B中文资料德州仪器数据手册PDF规格书

1 Features

1• Available in the Texas Instruments

Package

• Supports 5-V VCC Operation open•

Max t pd of 3.4 ns at 3.3 V

• Low Power Consumption, 10-μA Max ICC

• ±24-mA Output Drive at 3.3 V

• Typical VOLP (Output Ground Bounce)

<0.8 V at VCC = 3.3 V, TA = 25°C

• Typical VOHV (Output VOH Undershoot)

>2 V at VCC = 3.3 V, TA = 25°C

• Inputs and Open-Drain Outputs Accept

Voltages up to 5.5 V

• I off Supports Live Insertion, Partial-Power-Down

Mode and Back-Drive Protection

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• Supports Down-Translation

(5 V to 3.3 V and 3.3 V to 1.8 V)

• ESD Protection Exceeds JESD 22

– 2000-V Human Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

2 Applications

• AV Receivers

• Blu-ray Players and Home Theaters

• DVD Recorders and Players

• Desktop or Notebook PCs

• Digital Radio or Internet Radio Players

• Digital Video Cameras (DVC)

• Embedded PC

• GPS: Personal Navigation Devices

• Mobile Internet Devices

• Network Projector Front-End

• Portable Media Players

• Pro Audio Mixers

• Smoke Detectors

• Solid-State Drive (SSD): Enterprise

• High-Definition (HDTV)

3 Description

This dual inverter buffer and driver is designed for

1.65-V to 5.5-V VCC operation.

The output of the SN74LVC2G06 device is an open•

drain which can be connected to other open-drain

outputs to implement active-low, wired-OR, or active-

high wired-AND functions. The maximum sink current

is 32 mA.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs, preventing damaging current backflow

through the device when it is powered down.

NanoFree™ package technology is a major

breakthrough in IC packaging concepts, using the die

as the package.