SN74LVC1G99集成电路（IC）的门反相器-多功能可配置规格书PDF中文资料

SN74LVC1G99属于集成电路（IC）的门反相器-多功能可配置。由德州仪器制造生产的SN74LVC1G99门和反相器 - 多功能，可配置可配置逻辑栅极系列产品能以与标准逻辑栅极类似的方式，对单个逻辑信号执行基本逻辑运算，但并非局限于一个特定功能（例如 AND、NAND 等）。它们通常在内部使用少量逻辑门来实现，经过选择和互连后，以便通过选择操作数据所应用的输入以及任何未使用的输入在驱动后的逻辑状态，来配置所实现的整体逻辑功能。

1FEATURES

2• Available in Texas Instruments

NanoFree™ Package

• Supports 5-V VCC Operation

• Inputs Accept Voltages to 5.5 V

• Supports Down Translation to VCC

• Max tpd of 6.7 ns at 3.3 V

• Low Power Consumption, 10-μA Max I CC

• ±24-mA Output Drive at 3.3 V

• Offers Nine Different Logic Functions in a

Single Package

• Ioff Supports Live Insertion, Partial-Power-

Down Mode, and Back-Drive Protection

• Input Hysteresis Allows for Slow Input

Transition Time and Better Noise Immunity at

Input

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

DESCRIPTION

The SN74LVC1G99 device is operational from 1.65 V

to 5.5 V.

The SN74LVC1G99 device features configurable

multiple functions with a 3-state output. The output is disabled when the output-enable (OE) input is high.

When OE is low, the output state is determined by 16

patterns of 4-bit input. The user can choose logic

functions, such as MUX, AND, OR, NAND, NOR,

XOR, XNOR, inverter, and buffer. All inputs can be

connected to VCC or GND.

This device functions as an independent inverter, but

because of Schmitt action, it has different input

threshold levels for positive-going (VT+) and negative-

going (VT–) signals.

To ensure the high-impedance state during power up

or power down, OE should be tied to VCC through a

pullup resistor; the minimum value of the resistor is

determined by the current-sinking capability of the

driver.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs, preventing damaging current backflow

through the device when it is powered down.

NanoFree™ package technologies are a major

breakthrough in IC packaging concepts, using the die

as the package.