SN74LVC1G27DBVR.B中文资料德州仪器数据手册PDF规格书

1FEATURES

2• Available in the Texas Instruments NanoFree™

Package

• Supports 5-V VCC Operation

• Inputs Accept Voltages to 5.5 V

• Supports Down Translation to VCC

• Max tpd of 4.5 ns at 3.3 V

• Low Power Consumption, 10-μA Max ICC

• ±24-mA Output Drive at 3.3 V

• I off Supports Live Insertion, Partial-Power-

Down Mode, and Back-Drive Protection

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

DESCRIPTION

The SN74LVC1G27 device performs the Boolean

function Y = A + B + C or Y = A • B • C in positive

logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die

as the package.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs, preventing damaging current backflow

through the device when it is powered down.