丝印：LVC161284；Package：TSSOP；19-BIT BUS INTERFACE

1.4-kΩ Pullup Resistors Integrated on All Open-Drain Outputs Eliminate the Need for Discrete Resistors ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Designed for the IEEE Std 1284-I (Level 1 Type) and IEEE Std 1284-II (Leve

文件：507.73 Kbytes 页数：19 Pages

TI

德州仪器

丝印：LVC161284；Package：TSSOP；19-BIT BUS INTERFACE

1.4-kΩ Pullup Resistors Integrated on All Open-Drain Outputs Eliminate the Need for Discrete Resistors ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Designed for the IEEE Std 1284-I (Level 1 Type) and IEEE Std 1284-II (Leve

文件：507.73 Kbytes 页数：19 Pages

TI

德州仪器

19-BIT BUS INTERFACE

文件：206.13 Kbytes 页数：12 Pages

TI

德州仪器

19-BIT BUS INTERFACE

文件：340.22 Kbytes 页数：14 Pages

TI

德州仪器

Package：48-TFSOP（0.240"，6.10mm 宽）；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：集成电路（IC） 专用逻辑器件 描述：IC BUS INTERF TRI-STATE 48-TSSOP

TI

德州仪器